Search results for "skills gap"
A.R.T. to exhibit at SMTconnect
Advanced Rework Technology (A.R.T.) will exhibit at the SMTconnect exhibition in Nuremberg, Germany, June 11th – 13th, on the What’s New in Electronics pavilion, Hall 4 227.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...
Würth Elektronik expands its range of power inductors
In addition to Würth Elektronik’s five existing package sizes of WE-XHMI SMT power inductors there are now eight new packages.
New survey to assess high-demand job skills in microelectronics
SEMI invites key industry stakeholders to participate in a survey designed to assess job skills in highest demand in Europe's microelectronics industry in 2024.
EWB UK addresses sustainability skills gap in engineering
Engineers Without Borders (EWB) UK has launched the Global Responsibility Competency Compass, with support from the Royal Academy of Engineering.
Large-scale gigawatt nuclear power plant planned for North Wales
Wylfa in Anglesey has been designated by the government as the preferred site for the UK’s third mega-nuclear power station.
Green tech at Coventry University’s Institute for Advanced Manufacturing and Engineering
The future of green transport technology has been on show at Coventry University’s Institute for Advanced Manufacturing and Engineering (AME).
Robotics cluster launches in Cumbria
Robotics is fast becoming a go-to for nuclear decommissioning advances and today marks the launch of the Cumbria Robotics Cluster, an initiative powered by the Industrial Solutions Hub (iSH) to harness and expand the region’s capabilities in cutting-edge engineering and problem-solving.
Siemens simplifies development of AI accelerators
Siemens Digital Industries Software announced Catapult AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs).
Ansible Motion’s simulator selected to boost Formula E team
Penske Autosport is the latest professional motorsport team to add Ansible Motion’s Delta S3 Driver-in-the-Loop (DIL) simulator to its arsenal, as the team mounts its title challenge in the 2024 FIA ABB Formula E Championship.