Search results for "miniaturisation"

The requirements for electronic assemblies are becoming more and more demanding. This is not only due to an increase in packaging density and progressive miniaturisation, but also to an increase in areas of application,openair-plasma pre-treatment could be the solution.

At ISSCC 2020 (Feb 16th to 20th, San Francisco), imec presented the first mm-scale wireless transceiver for smart insertable pills. It is a first breakthrough in imec’s aspiration to realise autonomous ingestible sensors that can measure health parameters such as gut health and transmit in real time the data outside the body.

ROHM has announced the availability of shunt resistors, GMR50 series, delivering four watt rated power (at electrode temperature TK=90°C) in the compact 5.0x2.5mm (2010 type package) size. It is well suited for current detection in motors and power supply circuits used in automotive systems and industrial equipment.

Hirose has produced a very low profile Push-Push MicroSD connector. Featuring a profile of only 1.15mm, the miniature DM3NW Series MicroSD connector enables smaller consumer electronic designs by reducing the volumetric space. The push/push type DM3NW Series MicroSD connector is well suited for a wide range of consumer electronic applications.

HARTING will be demonstrating their innovative connector and Industry 4.0 solutions at the Drives & Controls Exhibition at the NEC in Birmingham from the 21st to the 23rd April 2020. On show will be the newest addition to the Han portfolio, the Han F+B, a range specially designed for the food and bottling industries, where hygiene and safety are key considerations.

Not only are electronic modules and devices becoming smaller and smaller, they also often contain multiple communications interfaces with data rates up to the Gbit/s range. And integrated components are being supplied with ever lower, tighter tolerance voltages. These are major test and measurement challenges.

WISeKey, ON Semiconductor and Tatwah have announced the release of the first Secure IoT Beacon device. The IoT Beacon device was first introduced at TRUSTECH 2019,an event dedicated to payments, identification and security in France.The IoT Security Beacon embeds the Bluetooth 5 RSL10 System-in-Package (RSL10 SIP) from ON Semiconductor.The all-in-one solution is fully certified to worldwide regulatory standards, and offers Bluetooth 5 features wh...

According to latest report 'Smart Sensor Market by Application (Commercial/Industrial, Residential/Smart Homes, Consumer Electronics, Automotive, Oil & Gas, Aerospace & Defense), Product (Temperature & Humidity, Pressure, Motion, Position, Flow, Image, Touch), Technology (MEMS, CMOS), Network (Wireless, Wired), Regional Outlook, Price Trends, Competitive Market Share & Forecast 2024'by Global Market Insights, themarket valuation o...

A new range of Surface Mount Device (SMD) safety certifiedMulti Layer Ceramic Capacitors (MLCCs) designed for use in mains-powered applications, have been launched by KEMET.The CAS series addresses widespread demand for miniaturisation without compromising performance by offering higher capacitance, smaller overall size and simplified assembly versus existing leaded disc devices which represent the majority of safety-certified ceramic capacitors ...

Hirose has developed the lowest profile push/pull Nano SIM card connector. Featuring an ultra-low profile of 1.12mm, the KP13C Nano SIM card connector offers a Printed Circuit Board (PCB) mounting space savings of up to 23% compared to other products on the market.