Search results for "SEMI MEMS"

Renesas has introduced two semiconductor solutions for the rapidly growing IO-Link market: the CCE4511 four-channel IO-Link master IC and the ZSSC3286 - IO-Link ready, dual-channel resistive sensor signal conditioner IC.

Infineon Technologies is paving the way to a significant reduction of plastic waste and CO2emissions in the payment card industry. The company has announced the launch of SECORA Pay Green which enables card designs allowing production of the world’s first fully recyclable contactless (dual-interface) payment card bodies based on environmentally friendly and locally sourced materials.

The 'Navigating T&M Instruments' seminar, designed to cater for all levels of experience, will feature a series of presentations led by test and measurement experts from Rohde & Schwarz.

More than 700 key figures from the semiconductor and photonic chip sectors have gathered in Eindhoven for one of the largest summits of its kind to discuss the industry's future.

electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.

Infineon is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector.

Indium Corporation is pleased to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), to be held from 16-18 October in Penang, Malaysia.

NXP Semiconductors has unveiled its new S32J series of high-performance Ethernet switches and network controllers.

Lauterbach and Kernkonzept enable architects of virtualised software systems to start development and testing on future RISC-V platforms even before corresponding System-on-Chips (SoCs) are available in silicon.

The Hong Kong Applied Science and Technology Research Institute (ASTRI) is presenting its advanced smart mobility technologies, including state-of-the-art Cellular Vehicle-to-Everything (C-V2X) systems aimed at improving autonomous driving safety, at the 44th HKTDC Hong Kong Electronics Fair, from 13-16 October.