Search results for "Master Bond"
The wide world of sensor-embedded sports
Rolf Horn, Applications Engineer at Digikey, takes a look at the technology revolution coming to the world of sports.
Infineon @ TRUSTECH 2023
At TRUSTECH, the tradeshow for innovative payment and identification solutions, Infineon will present the latest member of the TEGRION family, which accelerates future-proof ID applications. Infineon’s mini airport booth will also feature the world’s first PQC-enabled ePassport demonstrator. In addition, visitors can experience the convenience of seamless payment with SECORA Pay X, which will be demonstrated in a pop-up manicure salon...
SOLEK closes a $379 million financing for portfolio of Chile PV projects
Solar energy group SOLEK has closed a $379 millionfinancing for its portfolio in Chile, consisting of solar photovoltaic utility-scale and PMGD plants located inthe Central Region.
DNV to industrialise new quality platform for industrial 3D-Printing solutions
DNV and Siemens Energy are about to take additive manufacturing (AM) – also known as 3D-printing – into the next stage of maturity.
Infineon’s EV thermal management webinar now available
Infineon has offered valuable perspectives on the electric vehicle thermal management systems market in its latest webinar.
Agile Analog appoint former GUC Europe President as VP of Sales
Agile Analog has announced the appointment of Christelle Faucon, former President of GUC Europe, as its new VP of Sales.
Heraeus receives global technology award
Heraeus Electronics has announced its receipt of the‘2023 GLOBAL Technology Award’in the category of Solder Paste.
WirelessCar continues its international expansion
WirelessCar, an innovator of connected vehicle services, continues its international expansion by opening a German branch in Munich.
Fluxless soldering using formic acid vapor for optoelectronics
Soldering using formic acid vapour in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several products in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.
HyRel showcase at SMTA Silicon Valley Expo & Tech Forum
HyRel Technologies has announced plans to exhibit its Robotic Hot Solder Component Tinning technology at the SMTA Silicon Valley Expo & Tech Forum on 7th December 2023, hosted at Flextronics in Milpitas, CA.