Search results for "vector informatik"
Anritsu introduces the IQ Signal Master
Anritsu introduces the IQ Signal Master MX280005A Vector Signal Analysis software that delivers expanded post-processing measurements and analysis of IQ data files captured on Anritsu Field Master Pro MS2090A, Remote Spectrum Monitor MS27201A, and Remote Spectrum Monitor MS2710xA spectrum analysers.
Fighting cyber attackers earlier to reduce risk
We face an exciting evolution in the cybersecurity sector, says Chris Roberts, Fortinet.
OpenHW Group Sets RISC-V Quality Standard
Imperas Software, provider of RISC-V simulation solutions, congratulates the OpenHW Group on the announcement of theCORE-V MCU Dev/Kitproject based on the high-quality CV32E40P open-source processor IP core, the first core to be fully verified within the OpenHW CORE-V family.
Anritsu is bringing signal testing and device characterisation to European Microwave Week
Anritsu is attending the European Microwave Exhibition, the largest trade show dedicated to Microwaves and RF in Europe, showing its most advanced testing solutions for signal generation and signal analysis.
Upgrades to R&S's network analyser family announced
Rohde & Schwarz has added new models and options to the R&S ZNB vector network analyser family, addressingapplications in the mmWave range such as 5G at FR2 frequencies and applications in aerospace anddefence in the Ka band.
Pico Technology at Embedded World 2022
At embedded world 2022 Pico Technology will present its latest PC-based test & measurement products including:
Multi-core RISC-V Vector Processor Debug at Embedded World 2022
The SiFive Intelligence X280 is a multi-core capable RISC-V processor with vector extensions and is optimised for AI/ML compute at the edge.
Rohde & Schwarz readies test line up for embedded world
Rohde & Schwarz will show an array of its latest test solutions at embedded world 2022 in Nuremberg (June 21 to 23), 2022.
Digital and RF expertise on parade at embedded world 2022
Keysight Technologies will use embedded world 2022 in Nuremberg (June 21-23) to demonstrate the company's expertise in digital, radio frequency (RF) and microwave technologies.
CEA-Leti & Intel report die-to-wafer self-assembly breakthrough
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.