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The Bioplastics Innovation Forum near Munich will host the unveiling of kinariTM, a pioneering material by Panasonic Industry.Distinguished by its robustness, kinariTM is crafted from cellulose fibre sourced from a variety of plant waste materials, combined with a minimal quantity of oil-based resin.

What do you do when the worst nightmare hits? That’s a question that 3D Plus faced when the 8 Gigabit DDR3 x32 DRAM component it was using for avionic and aerospace applications was discontinued.

Availability and full design support capabilities for a new LTE antenna from Taoglas have been announced by Richardson RFPD.

Taiwan Semiconductor has announced its new line of automotive-qualified rectifiers featuring ESD withstand capability.

Fairview Microwave has announced the launch of its latest product line: RF fixed attenuators and terminations with an operational frequency reaching up to 26GHz.

Empowering innovation will be the theme for Mouser Electronics at this year's AMPER exhibition in Brno, Czech Republic (March 19-21).

SolidRun has introduced its Ryzen V3000 CX7 Com Module, marking a significant advancement in networking and Edge solutions.

Avalue Technology’s new EPS-RPS embedded rugged fanless system with Intel’s 13th Gen Raptor Lake-S is in stock at distributor Solsta.

Amdocs, a provider of software and services to communications and media companies, has announced new capabilities related to its telco-native Generative AI (GenAI) platform, amAIz.

The UK Space Agency has unveiled a £10 million funding competition aimed at propelling UK firms to the forefront of the burgeoning telecommunications sector globally.