Search results for "microelectronics"
Systems memory solution supports multicore MPUs
A system memory solution for the recently introduced STM32MP1 multicore microprocessor series is available at distributor Rutronik. This offers compute and graphics support combined with power-efficient real-time control and will facilitate development of high-performance solutions for Industrial, Consumer, Smart Home, Health and Wellness applications.
Smart embedded motor drive portfolio for automotive applications
Global microelectronics engineering company, Melexis, has announced the latest addition to its Generation II embedded motor driver product portfolio for automotive applications, with the release of the MLX81206. This single-chip solution with 64 KB Flash memory offers higher integration with the ability to drive BLDC motors from 100W to 1,000W.
Ultra-low noise amplifier boasts 0.27dB noise figure
Availability and full design support capabilities for an ultra-low noise amplifier from WanTcom have been announced by Richardson RFPD. At +12V DC operation, the unconditionally-stable WBA0180210A offers 0.27dB noise figure, with 27dB of gain and +10dBm P1dB.
RGB-IR solution for automotive cabin monitoring systems
Developer of advanced digital imaging solutions, OmniVision Technologies, and Fullhan Microelectronics, a provider of chips and solutions for video surveillance products, have announced a joint solution for capturing and processing high quality colour (RGB) and infrared (IR) automotive interior images, day and night, with a single camera.
Southeast Asia innovation centre expanded in Singapore
Palomar hasannounced it has expanded its Innovation Centre in Singapore to further meet the growing demands of photonics companies designing and launching new high performance packages that enable the IoT and 5G wireless networks. The expansion has provided the opportunity for Palomar to add their latest die bonder designed for thedemandingassemblyneedsof advanced photonics packages -the 6532HP Die Bonderwhichexceeds industry standards for placem...
More space for innovation with expanded development site
It has been announced that Infineon is hoping to strengthen its research and development efforts in the field of high-frequency components. To this end the Infineon Austria holding company DICE (Danube Integrated Circuit Engineering) in Linz will be provided with a new home.
Single board computer deployed on JAXA’s GOSAT-2 mission
Another successful flight of its SCS750 Single Board Computer (SBC) on the Second Greenhouse Gases Observing Satellite (GOSAT-2) has been announced by Data Device Corporation (DDC). Mitsubishi Heavy Industries and JAXA successfully launched H-IIA Launch Vehicle No. 40 (H-IIA F40,) which encapsulates the GOSAT-2 satellite, on October 29th, 2018 from the JAXA Tanegashima Space Center.
Physical security is key to keeping online data safe
Security specialist Abloy UK has highlighted the importance of physical security to protect against digital data breaches, following the recent approval of a new standard that offers the ability to add tangible authentication to secure online accounts.
Improving efficiency in cars for electromobility
To improve the efficiency in modern cars on the way to electromobility and in challenging industrial power conversion applications the power density has to be increased without limitations on performance and reliability. Based on the AT&S ECP (Embedded Components Packaging) technology active and passive components have been integrated into PCBs for low-power designs and are used in volume production meeting high-quality requirements.
Development platform speeds real-time projects
To connect the power and flexibility of the latest STMicroelectronics STM32MP1 microprocessor with the strength of the STM32 and 96Boards ecosystems, Arrow Electronics has introduced the Avenger96 Development Platform and System on Module (SoM) The SoM, based on the Linaro 96Boards specification, can be used in production systems as well as for development.