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Infineon Technologies and Hi-Lo Systems, a Taiwan based IC programming and testing company, have announced their partnership in the area of Trusted Platform Module (TPM) security chips.

electronica 2024 will bring answers to the major challenges facing the automotive industry, focusing on digitalisation and innovation.

Decarbonisation and digitalisation are the two defining challenges of our time. However, one cannot be achieved without the other, Infineon explores.

Lighting accounts for a significant portion of the world's total electricity consumption, emphasising the importance of energy-efficient solutions in this sector.

Infineon has launched the SEMPER Nano NOR Flash memory optimised for battery-powered, small-form-factor electronic devices. Emerging wearable and industrial applications, including fitness trackers, hearables, health monitors, drones, and GPS trackers, enable more with precision tracking, critical information logging, enhanced security, noise cancellation, and more.

The Graphene Flagship is hosting a symposium 11–12 June 2024 at the Town Hall Europe, Brussels, to celebrate the successes of its €20 million 2D Experimental Pilot Line (2D-EPL) project.

Infineon and Hi-Lo Systems have announced their partnership in the area of Trusted Platform Module (TPM) security chips.

Following the success of its inaugural edition, the second Electronics Asia Conference (EAC), a virtual conference and exhibition organised byAspenCore, the publisher of EE Times Asia, EE Times India, and EDN Asia, is set to take place from October 17 to 19, 2023.

Infineon Technologies has finished its 23rd Annual General Meeting. The entire event was held in a virtual format and broadcast publicly on the company web site. Shareholders had the opportunity to speak live during the event and ask questions.

German President Frank-Walter Steinmeier visited Infineon Technologies in Kulim, Malaysia, as part of his trip to Asia. The visit focused on Infineon's contribution to enabling the global energy transition with energy-saving semiconductor solutions, as well as by investing in solutions that further reduce the CO2footprint in its chip manufacturing.