Search results for "gan"
Simoncic promoted to COO role at Microchip Technology
Microchip Technology has appointed Rich Simoncic as Chief Operating Officer.
Pasternack expands low-PIM product line
Pasternack has announced its latest low-PIM product offerings to enhance wireless infrastructure.
Diamfab secures €8.7M
Diamfab, a semiconductor diamond deeptech, has announced a first round of funding of €8.7 million, from Asterion Ventures, the French Tech Seed fund managed on behalf of the French government by Bpifrance as part of France 2030, Kreaxi with the Avenir Industrie Auvergne-Rhône-Alpes regional fund, Better Angle, Hello Tomorrow, and Grenoble Alpes Métropole.
Innoscience to demonstrate that GaN is the best power solution
Innoscience Technology, the company founded to create a global energy ecosystem based on high-performance, low-cost, gallium-nitride-on-silicon (GaN-on-Si) power solutions, will continue to demonstrate its focus and 100% commitment to the burgeoning GaN market via a powerful presence at the upcoming PCIM conference and exhibition in Nuremberg, May 9th – 11th.
Navitas GaNSafe opens data centre, solar and EV opportunities
Navitas has announced the world-wide launch of GaNSafe, a new, high-performance wide bandgap power platform at a special customer, partner and press event in Taiwan.
C2000™ 32-bit MCU 120-MHz 384-KB flash, FPU, TMU with CLA, CLB, AES and CAN-FD
The TMS320F28003x (F28003x) is a member of the C2000™ real-time microcontroller family of scalable, ultra-low latency devices designed for efficiency in power electronics, including but not limited to: high power density, high switching frequencies, and supporting the use of GaN and SiC technologies.
PCIM Asia 2023 showcased the future of power electronics
With 181 exhibitors and 15,348 visits, this year’s edition of PCIM Asia saw three days of high-level business exchange, networking, and showcases of the most innovative products on the market.
TI to showcase technologies for a safer, smarter, and more sustainable future
Texas Instruments (TI) will demonstrate new embedded processing and connectivity products for enabling a safer, smarter, and more sustainable future at embedded world.
GaN and SiC technologies on spotlight at PowerUP Asia Conference
The power electronics landscape is changing. Wide-bandgap (WBG) devices, including gallium nitride (GaN) and silicon carbide (SiC), are gaining traction in replacing silicon devices, which are reaching their theoretical limits in performance, in applications including power modules and power inverters, motor drives, and chargers and adapters, to name a few.
Detent pin range grows to the largest available in the UK
WDS Components has extended its range of detent pins, adding over 400 new models that cover a vast range of styles, materials, and sizes.