Search results for "Leader"
dSPACE and Spirent to deliver integrated automotive test solutions
Spirent Communications and dSPACE have formed a technology partnership aimed at enhancing the realism of real-time positioning scenarios in Autonomous Driving Hardware-in-the-Loop (AD-HIL) test systems. This collaboration is set to expedite development processes and market entry for developers.
ChipStart UK: investors gather in Glasgow to see top semiconductor startups
Tens of investors, startups heads and representatives of government and multinational companies converged on the University of Glasgow on the 25thJanuary for ChipStart UK’s early-stage semiconductor incubator.
100 days to go until world-first consumer protections on smart products
The UK is set to become the first country in the world to implement revolutionary protections for consumers using smart devices. With only 100 days remaining, these measures will bring a new level of security to a wide array of connectable devices, including smartphones, games consoles, and smart doorbells.
Farnell, Wurth join to enhance home appliance design
Farnell has joined forces with Würth Elektronik (WE) to help design engineers further improve the connectivity and advanced feature sets of ordinary home appliances, without losing sight of the fundamental expectations for reliability, quiet operation and efficiency.
Würth Elektronik CTO presents cooperation in microalgae production at DLD
At the Digital Life Design (DLD) conference in Munich, an international hub for innovation and discussion, Würth Elektronik unveiled its latest collaboration with Agile Solutions.
Infineon and Wolfspeed expand and extend supply agreement
Infineon and Wolfspeed have announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018.
Strengthening the security of broadband 5G/6G communication networks
The security of communication networks is becoming more and more important with increasing digitalisation.
ASMPT in the semiconductor climate consortium
ASMPT, the innovation and market pioneer in surface-mount and semiconductor manufacturing technology and a Leadership Level founding member of the Semiconductor Climate Consortium (SCC), has officially announced its Net Zero 2035 strategy for climate neutrality.
ASMPT unveil one of its most advanced die bonding systems
ASMPT has unveiled the new version of the AMICRA NOVA Pro in Munich on 17th January 2024. This state-of-the-art platform merges high placement accuracy with swift cycle times and cutting-edge bonding technologies, marking a significant advancement in the field.
G’Day! Mouser opens Melbourne service centre
Mouser Electronics has opened a new Customer Service Centre in Melbourne to support its growing number of customers across Australia and New Zealand.