Search results for "LED"

Innoscience will demonstrate its position in the GaN market at the upcoming PCIM conference and exhibition (Nuremberg, June 11-13).

At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...

SKY Perfect JSAT, NTT DOCOMO, the National Institute of Information and Communications Technology (NICT), and Panasonic jointly announced that they have successfully conducted a 5G communication verification test in the 38GHz band from an altitude of approximately 4km using a small Cessna aircraft operated by Kyoritsu Air Survey simulating the eventual use of High-Altitude Platform Stations (HAPS). The demonstration was the first of its kind in t...

Techniche has announced the findings of a study on the reasons behind electric vehicle (EV) charger breakdowns, revealing that 30% of all malfunctions require an engineer visit for repairs.

The influence of artificial intelligence (AI) is driving up the energy demand of data centres across the globe.

A ‘treasure trove’ of data, including papers authored by UK scientists, has been released from the Euclid space telescope.

Danfoss Power Solutions has appointed Domenico Traverso as the president of its Fluid Conveyance division, effective 1st June.

ROHM and Nanjing SemiDrive Technology, one of China’s largest SoC manufacturers for smart cockpits, have jointly developed a smart cockpit reference design.

Mascot AS introduced its next-generation high-quality, high-performance NiMH battery charger, the new model 4040 NIMH.

Norwegian power design expert Mascot AS introduces its next-generation high-quality, high-performance NiMH battery charger, the new model 4040 NIMH.