Search results for "ASIC"

Recent reports suggest as many as 20 billion devices could be connected to the Industrial Internet of Things (IIoT) in a market potentially worth over $200 billion within a few years. For manufacturers keen to ensure their production facilities remain competitive, they will need to embrace the IIoT where the physical world is connected to the digital via smart sensors. Swindon Silicon explain.

Xilinx has introduced Zynq RFSoC DFE, a class of adaptive radio platforms designed to meet the evolving standards of 5G NR wireless applications.

Xilinx has introduced ZynqRFSoC DFE, a breakthrough class of adaptive radio platforms designed to meet the evolving standards of 5G NR wireless applications. Zynq RFSoC DFE combines hardened Digital Front-End (DFE) blocks and adaptable logic to build high performance, low power, and cost effective 5G NR radio solutions for a broad array of use cases ranging across 5G low-, mid-, and high- band spectrum.

Renesas Electronics hasannounced its 2nd generation of 15 new digital multiphase controllers and six smart power stages that support 10A up to 1000A+ digital computing loads for advanced CPUs, FPGAs, GPUs and Artificial Intelligence (AI) ASICs addressing IoT infrastructure systems.

Synopsys has unveiled its Silicon Lifecycle Management (SLM) platform, a data-analytics-driven approach to optimising SoCs from the design phase through to end-user deployment.The SLM platform, which is tightly coupled with Synopsys' market-leading Fusion Design Platform, will provide visibility into critical performance, reliability and security issues for the entirety of a chip's lifespan.

The Power Stamp Alliance (PSA) has announced that LoadSlammer, has joined the Alliance to bring the option for a consistent, standardised testing methodology to users of power stamps. This is the first time that a multi-vendor alliance around DC/DC power conversion has agreed a testing methodology and tools.

STMicroelectronics has added a QML-V qualified 7A DC/DC point-of-Load converter to its growing portfolio of radiation-hardened (rad-hard) integrated power products that deliver high power efficiency to satisfy the most demanding space applications.

Diodes Incorporated has announced the PI4ULS3V4857, a SD 3.0-compliant bidirectional level translator for use in communication, consumer, and computing system applications including smartphone handsets, notebooks, SD/MicroSD card readers, wireless access points, and 5G femtocells.

Rambus has announced it has achieved a 4Gbps performance with the Rambus HBM2E memory interface solution consisting of a fully-integrated PHY and controller. Paired with the industry’s fastest HBM2E DRAM from SK hynix operating at 3.6 Gbps, the solution can deliver 460 GB/s of bandwidth from a single HBM2E device.

Imec and CMST (an imec-affiliated research group at Ghent University), together with their partners the Instituto de Investigación Sanitaria Fundación Jiménez Díaz (Madrid, Spain) and Holst Centre (an open innovation initiative from imec and TNO, the Netherlands) have presented an artificial iris embedded in a smart contact lens.