Search results for "soldering"
Angled M12 SMT ruggedised connectors: small PCB footprint and high reliability
Provertha is expanding its circularconnector portfoliowith the new angledM12 Ruggedised connector series in straight and angled versions for PCB mounting using SMT connection technology (Surface Mounting Technology).
Farnell expands range of tools and production supplies
Farnellhas announced the expansion of its comprehensive range of tools and production supplies, aimed at enhancing the efficiency and performance of industrial operations.
Powerful UVC disinfection with more than 150mW per chip
US manufacturer Bolb annouces its UVC LED S3535-H. This emitter, which is distributed by LASER COMPONENTS, generates an output power of more than 150mW per chip and provides the strongest germicidal effect currently available on the market.
Vishay extends voltage options for snap-in capacitors
Vishay Intertechnology is extending its 299 PHL-4TSI snap-in, four-terminal aluminium electrolytic capacitor family with new 350, 500, 550, and 600V rated capacitors that greatly expand the range of capacitance-voltage combinations available to designers.
Intelligent power supply and charging interface
Würth Elektronik has presented its new USB socket WR-COM USB 3.1 PD Type C – Power Only SMT. Used exclusively for power transmission, it supports the USB Power Delivery (USB-PD) communication protocol for adaptive charging up to 240 W.
Emil Otto launches more variants of water-based flux
The Hessian flux specialistEmil OttoGmbH launched the water-based flux EO-G-006 back in 2023. This is a No Clean-Flux is suitable for wave, manual, and selective soldering of printed circuit boards.
Provertha expands range of circular connectors
Provertha is expanding its range of circular connectors with the introduction of the new M12 Ruggedised connector series, available in both straight and angled versions for PCB mounting via Surface Mount Technology (SMT).
Innovative bonding technologies for AI and electromobility
electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.
Indium will participate in IEMT
Indium Corporation is pleased to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), to be held from 16-18 October in Penang, Malaysia.
Bransys expands manufacturing capabilities
Bransys Group is pleased to announce the expansion of its manufacturing capabilities with the acquisition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens.