Search results for "semiconductor"

The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.

Nordic Semiconductor launches its nRF54L Series ofwireless SoCs, including the previously announced nRF54L15, and the new nRF54L10 and nRF54L05.

ROHM has developed surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals.

At electronica 2024, X-FAB announced its latest collaboration with SMART Photonics to drive photonics innovations within datacom, telecom and beyond.

Alif Semiconductor has released an evaluation board for its Balletto product. First launched at embedded world 2024, this solution is a Bluetooth Low Energy (BLE) wireless microcontroller featuring hardware optimisation for AI/ML workloads.

Navitas Semiconductor has announced the world’s first 8.5kW power supply unit (PSU), powered byGaN and SiC technologiesto achieve 98% efficiency, for next-generation AI and hyperscale data centres.

Navitas has announced it will preview several breakthroughs at electronica 2024 (Hall C 3, booth 129, November 12th- 15th).

Nordic Semiconductor will launch the first of its nRF54 series at electronica 2024, which is running from 12-15 November in Munich, Germany.

At this month’s IEEE Energy Conversion Congress and Expo (ECCE), Navitas Semiconductor is set to debut its innovative ‘IntelliWeave’ control technique.

electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.