Search results for "photon chips"

IC’Alps, a pioneer in ASIC/SOC design and supply chain management and SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, have announced that they are strengthening partnership to face growing demand in the segment.

Synopsys has announced the industry's first Ultra Ethernet IPand UALink IP solutions, including controllers, PHYs, and verification IP, to meet the demand for standards-based, high-bandwidth, and low-latency HPC and AI accelerator interconnects.

China has initiated an antitrust investigation into U.S. chipmaker Nvidia, scrutinising potential violations of anti-monopoly laws and commitments made during its 2020 acquisition of Mellanox Technologies. This development intensifies the ongoing technological competition between China and the United States.

Ultrasonic DIE bonding is a fast, clean, and efficient technology increasingly utilised in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a reliable bonds between semiconductor DIEs and substrates, significantly reducing thermal stress. The advantages of ultrasonic DIE bonding include rapid processing times, low temperatures, and excel...

Semidynamics has announced that UPMEM has selected Semidynamics as its core provider for its next generation of LPDDR5X Processing In Memory device.

Intel has added semiconductor-manufacturing and product development heft with the appointment of Eric Meurice, former president, chief executive officer and chairman of ASML and Steve Sanghi, chairman and interim chief executive officer of Microchip Technology.to Intel’s board of directors, effective immediately.

Avalue Technology is announcing its new Edge AI processing platform, powered by NVIDIA Jeston family.

At its annual re:Invent conference, Amazon Web Services (AWS) announced plans to construct a cutting-edgeartificial intelligence (AI) supercomputer, poised to become one of the most powerful of its kind globally.

As weapproach 2025, the electronics and software design landscape is poised for a series of significant shifts.

e-con Systems has developed TintE, a ready to deploy ISP IP core engineered to enhance image quality in embedded vision applications.