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Digital oscilloscopes arrive at DigiKey
Teledyne LeCroyT3DSO3000HD digital oscilloscopes are available in bandwidths of 200MHz, 350MHz, 500MHz, and 1GHz.
Amphenol/SV Microwave PCB Edge Launch Bulkhead Connectors
High-speed RF/coaxial solder-on bulkhead edge launch connectors suitable for high-frequency PCB applications where precision is key. They are designed to transmit a signal from a PCB to the outside of the box. Interface configurations include SMA, 2.92mm, 2.4mm, and 1.85mm.
A new approach to building electric vehicles
Donut Lab has developed an entirely new approach tobuilding electric vehicles. The company's development platform offers manufacturers a library of inter-compatible components that can be used to produce new electric vehicles such as supercars, buses, drones, or SUVs in record time.
Samtec AcceleRate slim cable assemblies save PCB space
Samtec, Inc.announces availability in production quantities of AcceleRate Slim Direct-Attach Cable Assemblies, the industry’s slimmest cable system.
Littelfuse expands NanoT IP67-rated tactile switch series
Littelfuse, Inc. announced the expansion of its NanoT tactile switch product line. The series, featuring miniature, surface-mounted, waterproof tactile switches, now includes new operational force options and top- and side-actuated models, further enhancing its application innext-generation smart wearables, wireless headsets, portable medical devices, and IoT systems.
Fairview Microwave launches spring-loaded adapters
Fairview Microwave, an Infinite Electronics brand, has announced the launch of its new spring-loaded adapters for the SMP, SMPM and SMPS connector series.
Elevate embedded security with Deos and Emproof Nyx
Emproof and DDC-I, a trusted provider of safety-critical real-time operating systems, have announced a strategic partnership.
Infineon and Siemens collaborate on software-defined vehicles
Siemens Digital Industries Software announced its ongoing collaboration with Infineon to combine Siemens embeddedautomotive software platform, based on the AUTOSAR Classic platform R20-11, with Infineon’s AURIX TC4x microcontroller.
Hybrid bonding for data highways
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.
Women triple AI adoption and are set to match men by 2024
The gender gap in generative AI usage is closing rapidly, fuelled by a significant increase in adoption among women. According to a new report from the Deloitte Centre for Technology, Media, and Telecommunications, the percentage of women using generative AI has tripled year-over-year, from just 11% in 2022 to 33% in 2023.