Search results for "Indium Corporation"

Indium Corporation will showcase its advanced assembly materials for power electronics, including the rapidly evolving EV manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan.

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP Japan 2024).

Indium Corporation will showcase its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, taking place from January 27thFebruary 1stin San Francisco.

Indium Corporation Senior Area Technical Manager Jason Chou is set to deliver a presentation at the Power Device & Module Expo, held in conjunction with NEPCON Japan, on January 24th in Tokyo.

Indium Corporation features its innovative Durafuse solder technology alongside its Rel-ionportfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, 9–11 April 2024, in Anaheim, California, US.

Indium Corporationwill feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaginghosted by IMAPS, 18–21 March 2024, in Fountain Hills, AZ.

Indium Corporation is proud to announce the addition of Sales Engineer Meik Fratzel to its European team.

Indium Corporation’s Principal Engineer – Advanced Materials, Andy C. Mackie, PhD., will conduct a webinar on the rapid advancements taking place within e-mobility electronics technology.

Indium Corporation has announced the acquisition of SAFI-Tech to advance low-temperature soldering technology.

Indium Corporation will showcase a newsolder preform technology at Productronica 2023 from the 14th to the 17th November in Munich, Germany.