Search results for "semiconductor"
CELUS goes global with simplified electronics design
We’re thrilled to announce the worldwide availability of the CELUS Design Platform, our AI-assisted hardware design tool that’s empowering over 12,000 engineers across the globe.
nanoSPECTRAL chip: a miniature cost-effective spectrometer
The nanoSPECTRAL chip is a chip-size spectrometer based on the nanoSPECTRAL technology developed at the Fraunhofer Institute for Integrated Circuits IIS.
Renesas and Intel collaborate on power management for Core Ultra 200V processors
Renesas Electronics, a premier supplier of advanced semiconductor solutions, has announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel Core Ultra 200V series.
DELO introduces UV-approach for fan-out wafer-level packaging
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.
Spirit Electronics adds zero-error systems for space applications
Spirit Electronics has announced Zero-Error Systems (ZES) to support ultra-high reliability semiconductors and ICs operating in challenging radiation environments.
SEMICON Europa 2024
SEMICON Europa 2024 is co-located with electronica and will take place in Munich, Germany, from November 12-15, 2024. Themed Innovation and Collaboration: Powering Sustainable Exponential Growth , SEMICON Europa supports the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. Only by fostering collaborative efforts, the semiconductor industry ...
SEMICON Europa to explore advanced packaging and fab management
Semiconductor industry experts will convene at SEMICON Europa 2024,12–15 November 2024 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
Devon college hosts International conference on photonics and optoelectronics
A prestigious international conference and exhibition on photonics and optoelectronics packaging was held atSouth Devon Collegerecently.The event was in partnership with IMAPS-UK and the Torbay Hi-Tech Cluster, with visiting international delegates.
Exclusive Webinar: Get charged up for the future!
Watch our exciting webinar and discover the power conversion topologies for bidirectional EV charging. Don'tmiss out on this electrifying opportunity! Register now to join us for the webinar and discover the potential of bidirectional charging.Today's global challenges of decarbonization, combined with rising energy demand, make bidirectional electric vehicle charging and how semiconductor solutions support this application more important than ev...
3D-printed active electronics
Researchers from MIT have stumbled upon a unique chain of materials that could enable the3D printingof active electronics. This discovery marks the first successful creation of semiconductor-free, 3D-printed logic gates and resettable fuses.