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Siemens Digital Industries Software announces that Japan-based Preferred Networks (PFN), a pioneer in deep learning and artificial intelligence technology, has selected Siemens’ PowerPro software to optimise the power efficiency of its next-generation AI processors.

QPT, a GaN-based motor drives, has announced its collaboration with INOPOL, the entrepreneurship and innovation hub of the Polytechnic Institute of Coimbra (IPC). This strategic move enables QPT to strengthen its research and development efforts while integrating into the local innovation ecosystem in Coimbra, near its Portuguese R&D office.

Ambarella,an edge AI semiconductor company, announces in advance of AutoSens Europe that its Oculii AI 4D imaging radar technology is deployed worldwide in the 2023 and 2024 Lotus Eletre electric hyper-SUV as well as the 2024 Lotus Emeya fully electric hyper-GT from Lotus Technology.

Averna is celebrating its 25th anniversary today as a specialist global Test, Measurement, and Quality Solutions provider.

AsAdvanced Engineeringapproaches, the excitement builds with fresh announcements of cutting-edge technologies and products to be showcased at the upcoming event at the NEC in Birmingham on 30–31 October 2024.

Researchers from the University of Michigan have developed a new type ofdisplay technologyinspired by the way squids communicate.

u-blox, a global provider of leading positioning and wireless communication technologies and services, has announced a strategic partnership with Topcon Positioning Systems, a global specialist in precision measurement and workflow solutions.

Congatec will highlight its Computer-on-Modules portfolio, featuring aReady.COM configurations, atembedded world NA(booth 2223).

At InnoTrans in Berlin, Syslogic is unveiling an AI-powered embedded system designed specifically for railway applications. The AI Railway Computer RML A4AGX, featuring the Jetson AGX Orin module, is set to drive advancements in the railway sector.

ASRock Industrial has introduced the IMB-X1900, a motherboard that combines innovation, processing power, and AI acceleration.