Search results for "NEC corporation"
Anritsu achieves GCF validation
Anritsu has announced full support for 5G and LTE Next Generation eCall (NGeCall) validated test cases on its 5G NR Mobile Device Test Platform ME7834NR enabling GCF certification.
Shifting to software to secure sustainability
In industries such asautomotive, aerospace, and energy, the move from traditional hardware, which can be timely and expensive to design and create, to embedding software systems is helping companies with their development processes and sustainability drive.
Cinch Connectivity Solutions: an overview
Cinch Connectivity Solutions is a provider of connectivity products and solutions for industries requiring high-performance interconnects.
DELO introduces UV-approach for fan-out wafer-level packaging
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.
Anritsu and Bluetest to support MIMO OTA measurements
Anritsu and Bluetest have combined their recent product upgrades to create an Over-the-Air (OTA) measurement solution in a MIMO environment for verifying RF performance in the tri-frequency bands of the latest WLAN standard (IEEE 802.11be).
Kontron to present ODM/EMS offering at electronica 2024
Kontron will present its expanded ODM/EMS offering with ‘Electronics²’ at electronica 2024 Munich in Hall A1, Stand 441.
Over two-thirds of Women in Tech demand more to elevate women in leadership
Sixty-eight percent of women agree that more can be done to improve the workplace for women in leadership roles, calling for improved career pathways and mentorship.
Efficient test coverage analysis with AI support
As part of the SYSTEM CASCON software platform from GÖPEL electronic,Test Coverage Analyzer(TCA) has been a powerful tool providing detailed information regarding test coverage and possible test gaps.
Global IoT providers to deliver more than just connectivity
Wireless Logic, a global pioneer in IoT connectivity, has released a new report exploring the connectivity challenges, priorities, and expectations of enterprises deploying IoT globally.
10 years of improved materials for microchip interconnections
More power, more energy-efficiency, more complexity – manufacturers of modern microchips are constantly facing new challenges, especially regarding the electrical connections required.