Search results for "spectrum instrumentation"

SolidRun has introduced its Ryzen V3000 CX7 Com Module, marking a significant advancement in networking and Edge solutions.

Infineon Technologies has unveiled its 750V G1 series of discrete CoolSiC MOSFETs, designed to cater to the growing requirements for enhanced efficiency and power density in both industrial and automotive power systems.

Alps Alpine has initiated the external sale of ICs, previously exclusive for internal application in its own products, now available under the Alps Alpine brand.

MEMPHIS Electronic is introducing a full range of completely lead-free memory modules ranging from the first DDR1 generation to the latest DDR5 generation at embedded world 2024 in hall 1, booth 340.

The AI-RAN Alliance has been launched at the GSMA Mobile World Congress in Barcelona, heralding a significant step forward in the fusion of artificial intelligence (AI) with cellular technologies to enhance radio access network (RAN) and mobile network capabilities.

Pasternack has unveiled its latest RF fixed attenuators equipped with 3.5mm connectors. These attenuators are designed to elevate RF signal management across a spectrum of applications.

VIAVI announced that it will showcase test, automation and optimisation solutions through a series of collaborative demonstrations with over 20 partners at MWC Barcelona, 26-29 February, 2024.

At this week’s IEEE International Solid-State Circuits Conference (IEEE ISSCC2024), imec, a global research and innovation hub in nanoelectronics and digital technologies, presents a low-power ultra-wideband (UWB) receiver chip that is ten times more resilient against interference from Wi-Fi and (beyond) 5G signals than existing, state-of-the-art UWB devices.

Artificial Intelligence (AI) hardware is increasingly drawing inspiration from the human brain’s structure and how it functions.

Quantica and ImageXpert have announced a strategic partnership to integrate their advanced technologies, focusing on high viscosity inkjet printing and material development.