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Farnell has officially reopened its global head office after completing in excess of £6m of improvement works.

intoPIX, a provider of innovative mezzanine compression technologies, revealed at IBC its line-up of FastTicoRAW & FastTicoXS (JPEG XS) Codecs optimised for ARM chipsets, including Apple silicon and the M1 chip.

LOPEC, the exhibition and conference for flexible, organic and printed electronics, will be held in the ICM at Messe München from February 28th to March 2nd, 2023. Visitors can look forward to a significant number of applications from the Smart Living segmennd

Trade fair presence in the context of the company’s 25th anniversary. Presentation of the versions of HALCON and MERLIC. MVTec offers diverse program of demos, talks, and events.

AkzoNobel and Microsoft have teamed up to explore how quantum computing could help fast track the development of high-performance and more sustainable paints and coatings.

SEMI, the industry association serving the global electronics manufacturing and design supply chain, today announced that members of the new Semiconductor Climate Consortium (SCC) will discuss key aspects of the group’s vision, goals and membership at two sessions during COP27 in Sharm El-Sheik, Egypt.

STM32 user-interface design environment adds support for powerful NeoChrom graphics accelerator with new screen rotation and texture-mapping capabilities.

Almost four-year-old conjoined Brazilian twins, Arthur, and Bernardo have been successfully separated with the help of virtual reality technology.

PTC has announced that, for the fourth consecutive year, it has been named the overall leader and a “Best in Class” vendor for its Vuforia augmented reality (AR) solution suite in PAC’s Innovation RADAR report.

A group of microprocessors (MPU) that enables both a high-definition human-machine interface (HMI) and quick startup for applications that require high throughput and real-time capabilities has been released by Renesas.