Search results for "congatec"

congatec AG announces a collaboration with leading systems service provider TQ (TQ-Systems / TQ-Components). The new partner will immediately begin utilizing congatec computer modules for the development of its customized systems. As a solutions partner, TQ will have access to congatec’s extensive range of COM Express products.

congatec AG, a leading manufacturer of embedded computer modules, announces UEFI support for the new conga-QA6 small form factor module. UEFI stands for Unified Extensible Firmware Interface.

congatec AG, a leading manufacturer of embedded computer modules, announces CAN (Controller Area Network) bus support on the conga-QA6 small form factor (SFF) Qseven module. This is the first congatec Qseven module to support this interface.

congatec AG, a leading manufacturer of embedded computer modules, presents conga-QA6, an extended temperature range small form factor module. The conga-QA6 is based on the Qseven® mobile standard and is equipped with the new Intel® Atom(tm) processor E6xx series as well as the Intel® Platform Controller Hub EG20T. All components of this design are specified for an industrial temperature range of -40°C to +85°C.

congatec AG releases the conga-TS77 which supports the latest 3rd generation Intel Core processor variants and the new Mobile Intel QM77 chipset. The Type 6 COM Express module offers more performance, improved energy efficiency, greater security thanks to Intel VT and optional Intel AMT 8.0 support.

MSC Vertriebs GmbH has become a member of the FeaturePak™ Initiative unveiled March 1, 2010 which supports a new flexible embedded I/O expansion standard. The FeaturePak™ specification defines tiny, application-specific I/O modules with a size of 65 x 43 mm that snap into low-cost, low-profile sockets on computer-on-module (COM) baseboards. With the I/O modules, customers are able to add additional functions to COM baseboards without adding h...

The Qseven Consortium announces that Foxconn Technology Group has joined the consortium, increasing the number of members to 25. The Qseven Consortium was founded in 2007 by congatec AG, Seco s.r.l. and MSC Vertriebs GmbH and has seen a steady increase in membership ever since.

AMD announced a strong lineup of motherboard products for AMD's 2011 low-power mobile platform (code-named Brazos) and the AMD Embedded G-Series platform for embedded systems (code-named eBrazos), both based on the first AMD Fusion Accelerated Processing Units (APUs). The 2011 low-power mobile platforms feature the new 18-watt AMD E-Series APU (code-named Zacate) or the 9-watt AMD C-Series APU (code-named Ontario).

Today, at the Embedded World tradeshow, the founding of the Standardization Group for Embedded Technologies ('SGET' for short) has been announced. Leading embedded computer manufacturers, namely Advantech, congatec, DATA MODUL, Kontron, MSC, SECO, and the publishers WEKA Fachmedien and Vogel Business Media have announced to be among the founding members.

congatec AG is set to expand its product portfolio with the addition of ARM technology. This will allow the company to offer products with extremely low power requirements in the future. As a first step in that direction, congatec is expanding its Qseven product family with Freescale processors. Up until now, congatec has focused exclusively on x86-based COMs (Computer-on Modules). As part of its new product strategy, the company now plans to ...