Search results for "circuit breakers"

The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions.

STMicroelectronics has commenced production of automotive high-side power switches featuring proprietary intelligent fuse protection and a Serial Peripheral Interface (SPI) for diagnostic data, enhancing resilience, and functional safety.

At this week’s IEEE RFIC Symposium, imec, a global pioneering research and innovation hub in nanoelectronics and digital technologies, presents a state-of-the-art CMOS-based beamforming transmitter for D-band wireless applications.

In the ever-changing, fast-paced automotive industry, the power of connections is more critical than ever.

Applications for surface mount chip resistors with high power requirements typically mean higher circuit temperatures due to thermal resistance limitations.

Siemens Digital Industries Software announced that, in collaboration with Samsung Foundry, it has developed new capabilities for manufacturing multi-die packaged designs at advanced nodes.

Swindon Silicon Systems, a mixed signal ASIC specialist and a Sensata Technologies company, will exhibit at SENSOR+TEST 2024 at the Nuremberg Exhibition Centre, Germany from 11–13 June, 2024.

Silicon Mountain has announced the availability of its conformal coating services. This service is designed to provide protection for printed circuit boards (PCBs), ensuring their reliability and longevity in various environmental conditions.

New families of silicon carbide (SiC) MOSFETs and Schottky Barrier Diodes (SBDs) in TSPAK packaging are being premiered by WeEn Semiconductors at PCIM Europe in Nuremberg (June 11-13).

Magnachip Mixed-Signal (MMS) has announced the release of a multi-functional Power Management Integrated Circuit (PMIC) and a multi-channel level shifter to regulate various voltages and signals within display panels in IT devices.