Search results for "SEMI MEMS"

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.

Spirit Electronics has announced Zero-Error Systems (ZES) to support ultra-high reliability semiconductors and ICs operating in challenging radiation environments.

Vishay Intertechnology has introduced two new IGBT and MOSFET drivers in the compact, high isolation stretched SO-6 package. Delivering high peak output currents of 3A and 4A respectively, the Vishay Semiconductors VOFD341A and VOFD343A offer high operating temperatures to +125°C and low propagation delay of 200ns maximum.

SEMICON Europa 2024 is co-located with electronica and will take place in Munich, Germany, from November 12-15, 2024. Themed Innovation and Collaboration: Powering Sustainable Exponential Growth , SEMICON Europa supports the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. Only by fostering collaborative efforts, the semiconductor industry ...

NXP Semiconductors has announced that its Trimension NCJ29Dx family, part of one of the industry’s broadest UWB portfolios, is the technology foundation for Audi’s advanced new UWB platform, delivering the precise and secure real-time localisation required by leading premium car manufacturers to enable hands-free secure car access via smart mobile device and other UWB-based features.

KYOCERA has further developed its high-end ceramic Starceram N3000 P and has launched a new silicon nitride for the functional testing of next-generation microchips.

Kontron will present its expanded ODM/EMS offering with ‘Electronics²’ at electronica 2024 Munich in Hall A1, Stand 441.

A prestigious international conference and exhibition on photonics and optoelectronics packaging was held atSouth Devon Collegerecently.The event was in partnership with IMAPS-UK and the Torbay Hi-Tech Cluster, with visiting international delegates.

FRAMOS, a global expert in vision systems, dedicated to innovation and excellence in enabling devices to see and think, announces a new strategic collaboration with NXP Semiconductors, a global pioneer in secure connectivity solutions for embedded applications.

Alpha and Omega Semiconductor (AOS) has announced it will exhibit and demonstrate the capabilities of its expanding line of breakthrough application-specific power semiconductor, power IC and module solutions at electronica 2024.