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G7 nations have signed an agreement to unite and harness the innovative potential of AI to usher in a new era of global productivity and economic growth.

TDK Corporation is expanding its Micronas 3D HAL position sensor portfolio with the introduction of the HAR 3920-2100, a dual-die sensor tailored for automotive and industrial use.

Infineon Technologies has unveiled a new collaboration with Thistle Technologies, a trailblazer in developing advanced security solutions for connected devices.

Kontron is showcasing its innovative Control Panel product line at embedded world 2024. This lineup, leveraging cutting-edge processor technology, incorporates Kontron's advanced QIWI Toolkit for software integration, with an option for CODESYS SoftPLC utilisation.

Lauterbach has expanded its TRACE32 toolset to now include support for the latest Armv9-based Automotive Enhanced (AE) CPUs: Arm Neoverse-V3AE, Cortex-A720AE, Cortex-A520AE, and Cortex-R82AE.

Infineon Technologies is propelling motor drive applications into the future with its newly unveiled OptiMOS 6 200V MOSFET product line.

Texas Instruments (TI) will demonstrate new embedded processing and connectivity products for enabling a safer, smarter, and more sustainable future at embedded world.

congatec has unveiled its latest innovation: the aReady.COM product family. This marks the inaugural phase of the aReady. strategy, designed to streamline the implementation of embedded and Edge computing technology.

Farnell has launched its new Design, Build, Maintain HUBto support how developers, OEMs and industrial customers navigate every stage of the product lifecycle, from conception to maintenance.

Thermaltronics USA, a manufacturer of award-winning solder robots, is pleased to announce its participation in the 2024 IPC APEX EXPO, taking place 9–11 April 2024 at the Anaheim Convention Centre in California.