Search results for "congatec"

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today announced that it has become a Participating Member of the Qseven Consortium, a multi-vendor standards body dedicated to advancing the Qseven computer-on-module (COM) standard.

congatec AG announces the immediate availability of Version 1.0 of the COM Express Design Guide for developers of COM Express modules.

congatec AG announces the new conga-XA945 module as the latest addition to the companies successful ETX/XTX product family. This extremely low-power and attractively priced module features 4 PCI Express links instead of an ISA bus. The module is equipped with the Intel Atom™ Processor N270 and a fully-featured Mobile Intel 945GME Express chipset including the Intel I/O Controller Hub 7-M.

Kontron announces that the inaugural meeting was held for the SGET Standardization Group for Embedded Technologies eV.. A group of embedded computing manufacturers have formed the registered association to drive standardization of embedded computing.

congatec AG has formed a U.S. company, congatec Inc., and will begin looking for a location for a California-based office immediately. The office will initially employ about 10 congatec employees headed by Ron Mazza, an industry veteran of more than 30 years.

The Qseven Consortium, initiated by congatec, Seco and MSC, has added five new participating members. This brings the total number of companies that actively support the new Qseven Computer-on-Module standard to a total of 10.

congatec AG has announced that it has extended its COM Express product family with its highest performance module, the conga-BM45. The new module features the latest Intel Core 2 Duo processor, T9400, with a core speed of 2.53 GHz, 6 MByte L2 cache and up to 8 GByte fast, power-saving DDR3 memory. The conga‑BM45 utilizes the powerful Mobile Intel GM45 Express chipset with integrated Mobile Intel Graphics Media Accelerator 4500MHD (Intel GMA...

congatec AG has announced that the company has been elevated from Affiliate to Associate status in the Intel Embedded and Communications Alliance (Intel ECA). The Intel ECA is an ecosystem of companies that provide embedded systems, services and applications in support of Intel’s embedded and communication business.

The Qseven Consortium has announced that Foxconn Technology Group, the only true e-enabled Components, Modules, Moves and Services (eCMMS] provider in the world, has joined the consortium, increasing the number of members to 25. The Qseven Consortium was founded in 2007 by congatec AG, Seco s.r.l. and MSC Vertriebs GmbH and has seen a steady increase in membership ever since.

congatec AG extends its COM Express product family with the highest performance module conga-BM57. It features the latest Intel Core i7-620M processor with a core speed of 2.66 GHz, with 4 MByte L2 cache and up to 8 GByte fast (1066 MT/s) dual channel DDR3 memory. The conga‑BM57 is a two chip solution which utilizes the powerful Mobile Intel QM57 Express Chipset. The integrated graphics controller is supporting the Intel® Flexible Display ...