Search results for "SEMI MEMS"
Aizu ramp up quadruples TI's GaN output
Texas Instruments has begun production of gallium nitride (GaN)-based power semiconductors at its factory in Aizu, Japan.
Consumers see high potential for climate protection and sustainability
Digital technologies enable companies to effectively address sustainability goals. Even though there are some considerable differences in the acceptance and usage intensity of the smart home and smart mobility, consumers in Europe, the US, and Asia see similarly high potential for climate protection through digital technologies.
RISC-V semihosting debugging for SEGGER's Ozone
SEGGER has expanded the capabilities of its debugger and performance analyser, Ozone, by adding semihosting support for debugging RISC-V applications.
Infineon at electronica 2024: decarbonisation and digitalisation
At the upcoming electronica trade show in Munich, Infineon will illustrate how its solutions are driving the global trends of decarbonisation and digitalisation.
Multi-protocol wireless MCUs in stock at Mouser
The new MCX W series microcontrollers (MCUs) from NXP Semiconductors are in stock at authorised distributor Mouser Electronics.
Pasternack unveils new cable assembly options
Pasternack, an Infinite Electronics brand, recently announced the launch of itssemi-rigid and conformable cable assemblyoptions.
Nordic to launch nRF54 series at electronica
Nordic Semiconductor will launch the first of its nRF54 series at electronica 2024, which is running from 12-15 November in Munich, Germany.
nanoSPECTRAL chip: a miniature cost-effective spectrometer
The nanoSPECTRAL chip is a chip-size spectrometer based on the nanoSPECTRAL technology developed at the Fraunhofer Institute for Integrated Circuits IIS.
Renesas and Intel collaborate on power management for Core Ultra 200V processors
Renesas Electronics, a premier supplier of advanced semiconductor solutions, has announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel Core Ultra 200V series.
DELO introduces UV-approach for fan-out wafer-level packaging
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.