Search results for "Rochester electronics"
Chiplet Center of Excellence begins operations
Three Fraunhofer Institutes have launched aforward-looking researchinitiative in Dresden: the Chiplet Center of Excellence (CCoE).
How Flexi-hibrid electronics can benefit aircraft interior applications
The aviation marketencompasses air travel and the activities facilitating it, so it includes the entire airline industry, aircraft manufacturing, military aviation, UAV’s, and much more.
DigiKey expands supplier portfolio and adds over 340,000 new products
DigiKey, a pioneering global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, is excited to announce significantportfolio expansionsin the first two quarters of 2024.
3D printing advanced electronics
The National University of Singapore (NUS) has recently unveiled a new technique that has the potential to change the fabrication of 3D-printed circuits, and could significantly impact the future of electronics in sectors such as healthcare, communications, and security.
Polar Instrument releases new fault locator
The new GRS200 fault locator from Polar Instruments employs well-established passive analogue signature analysis to compare a faultless assembly with the board under test.
Altus helps to enhance Nexperia's production capabilities
Altus Group has announced the successful implementation of the Essemtec Fox MFC Pick and Place system at Nexperia's Stockport facility.
Littelfuse introduces TVS diode series for avionics
Littelfuse has announced the release of the new SMBLCE-HR/HRA, SMCLCE-HR/HRA, and SMDLCE-HR/HRA High-Reliability Low Capacitance TVS Diode Series.
Take a new approach to ESD packaging for electronics
In the world of electronics manufacturing, ESD managers have the critical role of ensuring that components do not get damaged by electrostatic discharge (ESD). Corrosion protection is often a lower priority but should also be on the radar for manufacturers who want their electronics to reach the end user in good condition. Cortec has designed two-in-one ESD packaging solutions that meet both needs and is eager to turn the spotlight on EcoSonic ES...
Mouser-backed DS PENSKE Formula E team claim third
Mouser congratulates drivers Jean-Éric Vergne, Stoffel Vandoorne, and the DS PENSKE Formula E racing team for finishing in third place overall in the 2024 ABB FIA Formula E World Championship with 200 points. Vergne also finished fifth in the driver's standings with 139 points. Vandoorne finished tenth with 61 points.
Bourns AEC-Q200 compliant gas discharge tube series
Bourns has announced its latest AEC-Q200 compliant Gas Discharge Tube (GDT) family.