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RF Micro Devices, Inc. has announced the Company will showcase its broad portfolio of industry-leading products and technologies for the wireless and wired broadband markets at the 2011 IEEE International Microwave Symposium (IMS) in Baltimore, Maryland, from June 6 to June 8, 2011.

New low cost, high performance oven controlled oscillator added to growing line of frequency control products

Delivers industry’s highest frequency in smallest package for reliability amid extreme conditions.

Soitec announced today they are working together to develop engineered gallium nitride (GaN) substrates. The alliance will draw on Sumitomo Electric’s sophisticated GaN wafer manufacturing technology and Soitec’s unique Smart Cut™ layer transfer technology by which ultra-thin GaN layers are transferred from a single GaN wafer to produce multiple, engineered GaN substrates. The engineered substrates retain the original, high crystalline qual...

Broadcom has today released the BCM3472, the industry's first fully integrated 40nm Dual ISDB-T receiver chipset. Addressing the growing popularity of digital TV in Latin America, Broadcom is driving the deployment of digital terrestrial TV services in Brazil and a range of emerging markets around the world.

Sofradir, a leading developer and manufacturer of advanced infrared detectors for military, space and commercial applications, today announced that company executives will give five presentations on new trends in infrared (IR) detectors for military and space applications at the SPIE 2011 Defense and Security Symposium, April 25 – 29, in Orlando, Fl.

DuPont Microcircuit Materials has announced the introduction of the DuPont™ GreenTape™ 9K7 low temperature co-fired ceramic (LTCC) material system, designed for advanced high-frequency, microwave and millimeter wave electronic circuit applications within the aerospace, automotive, military, consumer electronics and telecommunications industries. DuPont™ GreenTape™ 9K7 LTCC material is a lead-free* glass-ceramic dielectric tape, and is ava...

Yole Développement announces its report “MEMS Packaging”. This report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates.

Silicon Laboratories today announced the Aero® IIed single-chip EDGE transceiver with a digital interface. The Aero IIed is fully compliant with the 2.5G DigRF specification version 1.12 and is pre-validated with leading DigRF baseband implementations. This latest addition to the patented, proven Aero family provides the industry’s smallest, most integrated and easiest to design and manufacture DigRF transceiver for GSM/GPRS/EDGE handsets, s...

To spur embedded design creativity and innovation in the area of green energy, Renesas Electronics today launched the RL78 Green Energy Challenge, a global design contest featuring the RL78 microcontrollers (MCUs) and a robust software support environment provided by Renesas Electronics and its Alliance Partner community.