Search results for "crystal oscillators "

Dialog Semiconductor plc today announced a high performance VoIP phone chipset, the SC14453. The single chip processor enters Dialog’s VoIP portfolio as its flagship product and integrates hardware blocks for best-in-class audio, security and graphics functionality. The SC14453 has been created for mid and high end desktop phones and extends Dialog’s portfolio - alongside Dialog’s SC14452 and SC14461 - of award winning Green VoIP ICs, which...

SiTel Semiconductor today announced how its successful collaboration with Target Compiler Technologies led to the creation of customized audio DSPs for its SC14452 Green VoIP processor. The DSPs combine extreme energy efficiency with high processing performance, enabling industry-leading audio quality and power consumption. Key components of the SC14452 that won a 2009 Frost and Sullivan Green Excellence Award, the DSPs were developed using Targe...

Integrated Device Technology today announced that it will be exhibiting industry-leading products from its expanding product portfolio at the 2011 Embedded World Exhibition and Conference on March 1-3 in Nuremberg, Germany.

AIM announces that it will highlight its full product line in Hall 7, Booth 219 at the upcoming SMT/Hybrid Packaging scheduled to take place 8 – 10th May, 2012 Messezentrum in Nuremberg, Germany.

eoSemi today disclosed further details of its innovative silicon oscillator technology, and announced that it has commenced shipping pre-commercial versions of its first product. The company is working with a small group of key strategic customers and partners. eoSemi’s ATOC (Accurate Timing Oscillator Circuit) technology allows the company to offer all-CMOS silicon alternatives to the costly, bulky quartz crystal oscillators that are used in a...

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces its DB-1538-2 Conductive Stringer Attach Adhesive, which is designed for use in thin-film, organic and thinned silicon solar modules.

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces two next-generation conductive grid inks, CI-1083-L and CI-1081-H, for use in thin-film solar modules. These material formulations have been optimized for excellent conductivity and low contact resistance on transparent conductive oxides used in solar applications.

Rakon has added ultra low noise 7.0 x 5.0 mm XOs and VCXOs to its expanding product portfolio. The RXO7050M (XO) and RVX7050M (VCXO) are available from 2.048 MHz up to 200 MHz in LVPECL, LVDS and CMOS outputs. The use of High Frequency Fundamental (HFF) inverted mesa crystals eliminates the sub-harmonics associated with other high frequency technologies.

INSIDE Secure and Integrated Device Technology has announced that the two companies have collaborated to bring to market a compact, single-package secure microcontroller and oscillator solution that significantly reduces the bill of materials when designing USB tokens for authentication and digital signatures.

Silicon MEMS Timing Solutions are Smallest, Thinnest, Shock and Vibration Proof