Search results for "semiconductor"
Fraunhofer IPMS bids farewell to Hubert Lakner on his retirement
Prof. Dr.-Ing. Dipl.-Phys. Hubert Lakner worked for 21 years as Institute Director at theFraunhofer InstituteforPhotonic Microsystems, headquartered in Dresden.At the same time, he held the Chair of ‘Optoelectronic Devices and Systems’ at the Institute for Semiconductor and Microsystems Technology at the University of Dresden.
STMicro and Qualcomm enter collaboration in wireless IoT
STMicroelectronics, a global semiconductor pioneer serving customers across the spectrum of electronics applications, and Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, announce a new strategic collaboration for the next generation of industrial and consumer IoT solutions augmented by edge AI.
IC Manage advances GDP-XL design and IP management
IC Manage has announced major advances to its GDP-XL design and IP management platform.
Engineering business leader to take over as President of the IET
Engineering business leader Warren East CBE has been appointed as the 143rd President of the Institution of Engineering and Technology (IET).
SEMI to develop cybersecurity strategy and roadmap
SEMI has announced the creation of a strategic roadmap for cybersecurity implementation throughout the semiconductor industry.
Silicon-proven 3nm, 24Gbps UCIe IP subsystem
Alphawave Semihas announced the availability of the industry's first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem.
Boosting solar cell efficiency and durability
Researchers at the Hong Kong University of Science and Technology (HKUST) have made significant strides in the development of perovskite solar cells, enhancing both their efficiency and durability through a novel molecular treatment.
ECS 2024 successfully concludes: industry insights and future outlook
On September 19, 2024, the Electronics Component Show (ECS) successfully concluded at Kassam Stadium in Oxford, UK, attracting numerous manufacturers, distributors, engineers, and procurement professionals in the electronic components industry.
Synopsys and TSMC Pave the path for trillion-transistor AI and multi-die chip design
Synopsysannounces its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.
Preferred Networks adopts Siemens’ software for next-gen AI chip design
Siemens Digital Industries Software announces that Japan-based Preferred Networks (PFN), a pioneer in deep learning and artificial intelligence technology, has selected Siemens’ PowerPro software to optimise the power efficiency of its next-generation AI processors.