Search results for "raspberry pi"
AIKO and ACAP to embark on $4m initiative
AIKO has partnered with the Australian Centre for Advanced Photovoltaics (ACAP) to set on a $4 million research and development initiative focused on enhancing silicon solar cell efficiency using advanced photon multiplication (PM) technology.
SRS announce interoperability with 9 O-RUs
Software Radio Systems (SRS) has announced that it has successfully integrated and tested nine Open RAN Radio Units (O-RUs) from Benetel, Foxconn, Picocom, Liteon, VVDN and AMD with its srsRAN Enterprise 5G software solution.
ABB and Blykalla collaborate on small modular nuclear reactor
ABB and Blykalla have signed a Memorandum of Understanding (MoU) to develop advanced nuclear reactor technology, with the aim of supporting Sweden’s efforts to produce clean and reliable baseload energy.
RECOM launches range of power modules
RECOM has launched a range of tiny DC/DCs for high-performance gate drive applications.
Vishay introduces new series of thermistors
Vishay Intertechnology recently introduced a new series of inrush current limiting positive temperature coefficient (PTC) thermistors.
ABLIC launches the S-821A/1B Series of 1-cell battery protection ICs
ABLIC has launched the S-821A/1B Series of 1-cell battery protection ICs which realise high side protection using Nch MOSFETs.
Top 5 IoT products in October
Electronic Specifier walks through the top 5 IoT products released this October 2024.
Engineers Without Borders NL wins Stamicarbon grant for Jos Green Centre
Engineers Without Borders NL (EWBNL) is proud to announce that it has been selected as the recipient of the prestigious Ideas-to-Reality grant from Stamicarbon, the nitrogen technology licensor of MAIRE S.p.A.
Perforce’s Helix Core now ISO 26262 certified
Perforce Software, a global provider of enterprise DevOps solutions, has announced its version control platform Helix Core has achieved ISO 26262 Functional Safety Process Certification by internationally-accredited certification body TÜV SÜD.
ESCATEC’s UV enhanced die bonder technology
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.