Search results for "nokia"
Green Hills Software Supports Sitara ARM Cortex-A8 Microprocessors from Texas Instruments
Green Hills Software announced the availability of its embedded software solutions for the Texas Instruments Incorporated (TI) Sitara™ AM3505 and AM3517 microprocessors (MPUs) based on the ARM® Cortex™-A8. Green Hills Software’s ARM-optimized solution includes the INTEGRITY® real-time operating system (RTOS), MULTI® integrated development environment (IDE), optimizing C/C++ compilers and Green Hills Probe. Green Hills Software brings mor...
Femtocells World Summit will review the latest Femtocell developments
Senior management from leading operators and OEMs will be meeting in London on 23rd – 25th June to discuss the way forward for ‘femtocells’ – a new technology that will give home owners and businesses their own cellular Basestation hooked into their broadband network.
Fixed/Mobile Convergence, All-IP Networks and Multimedia Broadband Services feature at Conference
This year’s 4th International Basestation Conference is the strongest yet and will be highlighting the three key themes of Network Evolution, Technology Evolution and Service Evolution. The event is being hosted in Dallas, Texas, USA from 7-9th November, 2006.
Nordic Semiconductor and Broadcom collaborate on Bluetooth low energy proximity fob prototype for mobile device security
Nordic Semiconductor Bluetooth low energy-powered security device communicates seamlessly with Broadcom Bluetooth v4.0 chip in first demonstration of latest Bluetooth wireless technology’s interoperability
“20% annual growth to reach $5.4B in 2017!” announced Yole Développement
Yole Développement announces its report “MEMS for Cell Phones & Tablets”. “New MEMS devices will benefit from the mobile device growth that is predicted for the coming years: phones and tablet will represent a 2.9B units in 2017 and most of them will integrate 5 to 10 MEMS devices”, announces Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies, Yole Développement.
Broadcom Delivers Nine New 40nm Set-Top Box Solutions for the Full Resolution 3DTV Internet Connected Home
Broadcom announced nine new cable, satellite and IP set-top box (STB) system-on-a-chip (SoC) solutions that enable multiple ways for consumers to experience the next generation Internet connected home featuring full resolution 3DTV. Designed in 40 nanometer (nm) CMOS process, all nine of Broadcom's new STB SoC solutions feature high integration, high performance and lower overall system cost.
RealVNC announces support for Nokia’s Terminal Mode
RealVNC today announced support for Terminal Mode, based on VNC technology. The recently released specification is proposed as an industry standard for the seamless integration of mobile devices and applications with vehicle infotainment systems. The Terminal Mode specification has been published by Nokia and CE4A (Consumer Electronics for Automotive), the automotive industry working group comprising Audi, BMW, Daimler, Porsche and Volkswagen. En...
Cambridge Wireless and Univ. Of Cambridge Eiffel Project announces master class in Wireless Sensing.
The Cambridge Wireless Sensing SIG in conjunction with the Univ. Of Cambridge Eiffel Project will be uncovering the secrets to success in Wireless Sensing. This half day free event will be taking place at the Computer Labs, University of Cambridge on the 7th April 2011, and is supported by the Discovering Start-Ups Project, an initiative funded by EEDA to support and showcase start up companies.
Digia Sign Qt Agreement with Nokia
Digia has revealed that it has signed an agreement to acquire Qt software technologies and Qt business from Nokia. Following the acquisition Digia becomes responsible for all the Qt activities formerly carried out by Nokia. These include product development, as well as the commercial and open source licensing and service business. Following the acquisition, Digia plans to quickly enable Qt on Android, iOS and Windows 8 platforms.
IDTechEx predict Flexible Barriers to be a $1 Billion Opportunity by 2022
As more and more flexible devices are becoming available, the need for better performing barriers and encapsulation materials at lower cost points intensifies. The stringent requirements make this a difficult task for some applications, although others, with less intensive demands are already appearing in the market. Examples include flexible electrophoretic displays (e-paper) currently being commercialized as e-book readers, smart labels, etc.