Search results for "congatec"

congatec AG continues its upwards trend recording a significant sales increase for the third quarter of 2010. In the first nine months of 2010 the company achieved overall revenue of 32 million Euro from the sales of embedded computer modules and accessories. This represents an increase of 86% over the same period last year.

The Qseven™ consortium, initiated by congatec AG and SECO, today announced the addition of two embedded computer module vendors. Both MSC Vertriebs GmbH, from Germany, and Hectronic, from Sweden, are taking steps to actively support the new small form factor.

congatec AG, a leading manufacturer of embedded computer modules, announces the appointment of Bob Pickles as Business Development Manager for the UK. Based at congatec's new UK sales and marketing office, Mr Pickles will be responsible for the multi-channel distribution strategy that includes both partner and direct sales.

congatec AG has announced the conga-XA945 module as the latest addition to the companies successful ETX/XTX product family. This extremely low-power and attractively priced module features 4 PCI Express links instead of an ISA bus. The module is equipped with the Intel® Atom™ Processor N270 and a fully-featured Mobile Intel® 945GME Express chipset including the Intel® I/O Controller Hub 7-M.

congatec AG, a leading manufacturer of embedded computer modules, announces support of up to three DisplayPort video interfaces for the current Type 2 COM Express modules conga-BM45 and conga-BM57.

Three new modules from congatec have been added to the congatec-AG COM Express family and as with previous models offer the full scalability of a new CPU platform. They are 100% image compatible and have a common software driver, which facilitates integration into various systems. In all, there are a total of thirteen module variants now available for conga-CS45, conga-BS45 and conga-BM45.

congatec AG announces the conga-TS67, a new low-power module for advanced designs. It supports Pin-out Type 6 and provides improved display options along with increased bandwidth thanks to digital display interfaces and additional PCI Express lanes. With new, super low-power Intel processors soldered on in a BGA package, the module is suitable for vibration-resistant applications.

High performance computers with dedicated applications for specific purposes include industrial PC operation. Christian Eder looks at embedded computing power for SMEs.

congatec AG has just introduced conga-TM77, a new module with a significant improvement in computing performance combined with enhanced energy efficiency. The crucial innovations in the 3rd generation Intel Core processors relate to the construction, with 3D Tri-Gate transistors and 22 nanometer technology, plus a more powerful integrated graphics core. The type 6 pinout and 3x digital display interfaces provide better display options and increas...

congatec has today announced the addition of the conga-BP77 to its portfolio of 3rd generation Intel Core modules. This version is based on the COM Express Type 2 connector pin-out and supports the PCI Express graphics port for high-performance external graphics.