Search results for "chip capacitors"
Google Cloud’s TPUs race to rival NVIDIA’s AI chips
A new Omdia research report, Checking in with hyperscalers’ AI chips: Spring 2024 finds that Google has taken a clear lead among the hyperscale cloud providers when it comes to their efforts to compete with NVIDIA in AI hardware.
Synopsys certification for digital and analog flows and IP
Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tapeouts.
RNWA automotive grade resistors now available
Applications for surface mount chip resistors with high power requirements typically mean higher circuit temperatures due to thermal resistance limitations.
Sondrel secures major funding
Sondrel has announced a major investment of £5.6 million by ROX Equity Partners Limited, a UK-based private equity investment holding company, through subscription for new shares.
Synopsys and Samsung collab on AI and HPC designs
Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tapeouts.
Researchers develop world's first chip-based 3D printer
Imagine a portable 3D printer that could fit in the palm of your hand, enabling the rapid creation of customised, low-cost objects on the go.
SI Sensors developing sensor for satellite
SI Sensors is developing a custom silicon image sensor for a meteorological satellite instrument for an Asian government agency.
GlobalFoundries, Diraq to make quantum chips with standard tools
Diraq announced a record control accuracy of 99.9% for a quantum bit (qubit) manufactured by imec using industry-standard CMOS materials on a 300mm silicon wafer.
hofer powertrain and ETH Zurich initiate GaN project
hofer powertrain announced the commencement of a research project in collaboration with the Swiss Federal Institute of Technology in Zurich (ETH Zurich), focusing on the development of a state-of-the-art multilevel Gallium Nitride (GaN) traction inverter.
WeEn Semiconductors releases advanced SiC technologies with TSPAK packaging
New families of silicon carbide (SiC) MOSFETs and Schottky Barrier Diodes (SBDs) in TSPAK packaging are being premiered by WeEn Semiconductors at PCIM Europe in Nuremberg (June 11-13).