Search results for "NXP"
Hardware Pioneers Max 2023: Where electronics, IoT connectivity, and embedded systems converge
Hardware Pioneers Max returns to London. This annual gathering, held on 13thJuly 2023, is dedicated to all those involved in developing connected and smart hardware solutions and bringing them to market.
System-on-module for energy efficient ML
A new, state-of-the-art System-on-Module (SoM) for energy-efficient machine learning edge devices has been released by Variscite.
pH2 click from MIKROE
MikroElektronika (MIKROE) has launched pH2 Click is a compact add-on board used to determine the alkalinity or acidity of a sample.
Siemens enhances NXpower Monitor with AI-driven electrical signature analysis
Siemens Smart Infrastructure has integrated electrical signature analysis (ESA) from Samotics into NXpower Monitor, its digital caretaker for electrical networks.
NXP collaborates with Foxconn on latest vehicle platforms
NXP Semiconductors has signed a memorandum of understanding with Hon Hai Technology Group ('Foxconn') to jointly develop platforms for a new generation of smart, connected vehicles.
NXP enables advanced Wi-Fi 6 performance for Honor Magic V
NXP Semiconductors has announced that its WLAN7207H 2.4GHz front-end integrated circuit (FEIC) enables Wi-Fi 6 connectivity in Honor’s flagship Magic V smartphone.
Development kit speeds prototyping for BLDC applications
NXP's MCSPTE1AK344 is a development kit engineered for BLDC motor control, targeting heating, ventilation, and air conditioning (HVAC) or electric pumps and three-phase PMSM control, targeting active suspension, electric powertrains, eTurbo, or belt start generators.
NXP announces collaboration with Plug and Play’s STARTUP AUTOBAHN
NXP Semiconductors announced its collaboration with Plug and Play’s flagship Open Innovation Platform STARTUP AUTOBAHN at their EXPO 2022.
Power-efficient SOM suits IoT applications
Mouser Electronics is now stocking the Summit SOM 8M Plus from Laird Connectivity.
NXP collaborates with ING and Samsung
NXP Semiconductors has announced that it is working with ING Bank N.V. on Project NEAR, ING’s pilot of UWB-based peer-to-peer payment application.