Search results for "LASER COMPONENTS"
Infineon launches contactless payment card SECORA Pay Green
Infineon Technologies is paving the way to a significant reduction of plastic waste and CO2emissions in the payment card industry. The company has announced the launch of SECORA Pay Green which enables card designs allowing production of the world’s first fully recyclable contactless (dual-interface) payment card bodies based on environmentally friendly and locally sourced materials.
New software enables SFC3000 to measure CO2 emissions
Newly released software from Sussex basedEx-i Flow Measurementenables the SFC3000 flow computer to calculate CO2 emissions from gas fuelled industrial processes and power stations and also record carbon subsequently captured for storage facilities rather than being released into the atmosphere.
Easy-PC celebrates 40 years of excellence in PCB design
Number One Systems, a PCB design solution company, celebrates 40 years of success with the release of its latest update, Easy-PC Version 28, featuring more than 40 new enhancements.
Molex explores evolution of 48V systems in automotive power
Molex, a global electronics specialist and connectivity innovator, has issued a new report on the growing traction of 48-Volt electrical system technology, which is poised to fuel major improvements in vehicle performance, efficiency, functionality, and comfort.
How integrated ASICs and ADCs enhance mixed signals
Here, Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, a specialist in custom IC design and supply, explains the importance of integrated mixed signal solutions in industrial sensing systems.
Molex explores evolution of 48V systems in new report
Molex has issued a new report on the growing traction of 48-Volt electrical system technology, which is poised to fuel major improvements in vehicle performance, efficiency, functionality and comfort.
Innovative bonding technologies for AI and electromobility
electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.
Absolutely buzzing: how biotracking is saving our pollinators
A team from the University of Oxford have been investigating the decline in insect populations and the impact this is having on our ecosystem.Biotracking technologyis a system of tracking insect movements and behaviours on a large scale by using a combination of radar, optical systems, and miniature chips to monitor insects like bees.
Infineon launches HybridPACK Drive G2 Fusion
Infineon is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector.
Comparing ultrafast fibre and tuneable ultrafast lasers
Chromacity has published an informative report comparing the advantages of ultrafast fibre lasers with a tuneable, ultrafast Ti Sapphire laser.