Search results for "magnetic"
Bringing economies of scale to MEMS
Baolab’s release of an evaluation kit for its first MEMS product built in the metal interconnect layer heralds the start of truly low cost and high volume MEMS technology, built within the standard CMOS BEOL process. Sally Ward-Foxton, Contributing Editor of ES Design Magazine reports.
Pulse Electronics’ New Sidewinder AC Current Sensor has a Dynamic Range of 0.10-1000+ Amps
Pulse have unveiled the latest addition to the Sidewinder product line-up, the PA3209NL. Responding to customer requests to extend this sensor technology to a wider range of their applications, Pulse has created this larger inner diameter product to accommodate current carrying conductors up to 0.750 inches (19.05mm) in diameter, or the industry standard 0.750 in. x 0.093 in. (19.05mm x 2.36mm) buss bar.
YAS532 – Ultra Miniature Tri-Axial Geomagnetic Sensor
Willow Technologies highly acclaims Yamaha’ latest sensational, tiny 1.5 x 1.5 x 0.65mm, Tri-axial Geomagnetic Sensor IC, for smartphones and tablet PCs. Yamaha continues to develop ever smaller sensors to exceed the demands of the smartphone and tablet PC market. The new YAS532 is 56% smaller than its predecessor, the YAS530.
DG38L Leaves Industry Standard Relays Standing
Willow Technologies introduces this unique PCB Power Relay, the DG38L from Durakool. Featuring a magnetic arc blowout, enabling the relay to switch 50% higher DC voltage than other relays of its type. The DG38L is designed to switch in applications where the DC voltage exceeds 24VDC. As the relay opens it will pull an arc.
ams Interface Chip offers bi-directional NFC, while harvesting RF emissions energy
Implementing instant, high-speed Near Field Communication between two independent devices has been made easier and cheaper with the introduction of the AS3953 interface chip from ams. The AS3953 offers a high data-rate interface between a NFC device such as a smartphone and any host microcontroller with a standard Serial Peripheral Interface.
IDT to Exhibit at Embedded Technology 2012
Integrated Device Technology have revealed today that it will be exhibiting industry-leading products from its growing product portfolio at Embedded Technology 2012, which will be held November 14-16 at the Pacifico Yokohama Convention Center in Yokohama, Japan. IDT will be located in booth E-11.
Full Range LEC-3000 Series Fanless Power Communication Platforms
Lanner Electronics unveiled the LEC-3000 series, a full range of fanless power communication platforms. This series includes both DIN-railed and rack-mount platforms. DIN-rail platforms consist of the LEC-3070, LEC-3010, and LEC-3012. The LEC-3100 (1U), LEC-3110 (1U), LEC-3200 (2U) and LEC-3210 (2U) have rack-mount form factors.
Axiomtek introduces DIN-rail Wide Temperature Range Fanless Embedded System
Axiomtek rolls out its new DIN-rail fanless ruggedized embedded system with extra low power Intel Atom processors Z510PT 1.1 GHz/ Z520PT 1.33 GHz and Intel US15WPT chipset, the rBOX111-4COM. Set out to meet the critical demands of almost any rugged environment, this compact unit supports wide temperature range and features 4 isolated COM & 2 isolated Ethernet ports, wireless (3G/GPRS or WiFi) connection, fanless & cableless design, RTC battery fu...
Micronas Presents High-Sensitivity Current Transducer For Use In Automotive and Industrial Applications
Micronas presents its CUR 3115, the most recent member of the CUR 31xy current transducer family basing its measuring principle on the Hall effect.
IDT to Develop Integrated Receiver Chip based on Qualcomm’s Wireless Power Technology
Integrated Device Technology and Qualcomm have today announced a collaboration to enable IDT’s development of an integrated circuit for consumer electronics devices based on Qualcomm’s WiPower Technology. This IC will be designed to meet the requirements of Qualcomm’s new near-field magnetic resonance wireless power charging solution that is designed to provide spatial freedom for charging consumer electronics, such as mobile phones and oth...