Search results for "congatec"
congatec - COM Express Basic Module with AMD Fusion Technology
congatec AG, a leading manufacturer of embedded computer modules, introduces a new COM Express product line based on the AMD Embedded G-Series platform. The integration of AMD Fusion technology expands the COM Express standard with a completely new processor architecture that combines processors and graphics cores in a compact package. System designers benefit from a powerful CPU and an even more powerful graphics performance, excellent performan...
Tough terminals – PC requirements for harsh logistics environments
DLoG GmbH, a leading provider of rugged industrial computers headquartered in Germany, with offices in the UK, Sweden, NL and USA, is currently developing particularly robust and mobile industrial PCs for use in forklift trucks and other vehicles. High demands are made on computers used in the transport and logistics sector due to the harsh environmental and operating conditions. In order to meet these challenges and to be able to react flexibly ...
congatec introduces entry-level module for COM Express Type 6 with new Intel Atom dual-core processors
congatec AG announces the conga-TCA, an entry-level model of its Type 6 Pin-out COM Express module range. The conga-TCA is available in three variants of the new Intel Atom dual-core processor generation, which are manufactured in 32nm technology – the Intel Atom N2600 processor with only 3.5W TDP (1M Cache, 1.6 GHz); the Intel Atom N2800 processor (1M Cache, 1.86 GHz) with 6.5W TDP; and the Intel Atom D2700 processor (1M Cache, 2.13 GHz) with ...
Dialog Semiconductor's DA6011 adopted by congatec for Qseven embedded PC (conga-QA6)
Dialog Semiconductor plc (FWB: DLG), a leading provider of highly integrated innovative power management semiconductor solutions, has announced that its DA6011, a companion IC for the Intel® Atom(TM) processor E6xx series, is being used in congatec's Qseven embedded PC conga-QA6 for clocking and power management.
congatec future-proofs ETX and XTX standard
congatec AG is giving the ETX and XTX form factors a viable future with the integration of AMD Fusion technology. Modules based on AMD Fusion processors deliver significant improvements with regard to performance and scalability.
congatec Expands its Design Activities in Czech Republic
congatec has announced that the company will be further extending its design activities in the Czech Republic as of May 1, 2009. For this purpose congatec will be taking on the complete design team of a major business alliance partner. This team, situated in Brno, consists of eight experienced hardware and software engineers and will be concentrating on the development of customized carrier boards for Qseven, XTX and COM Express computer modules....
congatec Starter Kit Enables Use of Intel® Atom™ Low-Power Technology in Vehicles
Applications based on the latest Intel® Atom™ processors offer high performance with minimal power consumption and are thus optimal for use on the go. Especially in cars, the symbol of mobility in our age, numerous applications are possible. congatec AG, in cooperation with Intel, Xilinx and Wind River, has developed a new starter kit to demonstrate the successful implementation of modern PC technology in demanding in-vehicle applications. Wi...
PICMG Consortium Releases New COM Express Design Guide
congatec AG announces the immediate availability of Version 1.0 of the COM Express Design Guide for developers of COM Express modules.
congatec unveils Qseven mini carrier baseboard for accelerated design-in
congatec AG presents the conga-QMCB, a new mini carrier baseboard for space-critical applications based on the Qseven standard. The baseboard is ideal for fast prototype design and compact, mobile applications. Measuring just 145x95 mm, the easy-to-integrate mini carrier board is packed with a wide range of state-of-the-art interfaces and is designed to accelerate the evaluation process in the design-in phase, thereby facilitating faster time-to-...
congatec AG gets one million Euros to promote further growth
congatec AG has announced that Technofonds Bayern (The Bavarian Technology Fund) of Bayern Kapital GmbH (Bavaria Capital) intends to increase its holding in the company by injecting a further one million Euros, together with a group of lead investors. Their total share holding will thereby increase to 11.1 %.