Search results for "Toshiba"

Toshiba has announced the development of an image recognition SoC (System on Chip) for automotive applications that implements deep learning accelerator at ten times the speed and four times the power efficiency of Toshiba’s previous product. Details of the technology were reported at the 2019 IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco on 19thFebruary.

Toshiba Machine partner, TM Robotics, welcomed three new partners to its distributor network at Automate 2019. Production Components Inc (PCI), BlueBay Automation and Global Manufacturing Incorporated (GMI) officially signed distributor contracts at the show, which was held on 8th-11th April, 2019 at McCormick Place, Chicago.

It has been announced that Toshiba Memory Europe and OSR Enterprises (OSR), creator of the EVOLVER automotive platform, will extend their collaboration on OSR’s in-car Datacenter to enhance live data management and logging in cars. The cooperation will combine technical know-how and hopes to create a ‘Datacenter on Wheels’ with high-density and low-power solid state drives.

Toshiba Electronics has released a dual MOSFET with high levels of ESD protection. The new SSM6N813R is intended for use in rugged automotive applications, including use as a driver IC for headlight LEDs, which require a high withstand voltage and a small footprint.

Circuit Breakers Market will surpass $21bn by 2024, as reported in the latest study by Global Market Insights. Affirmative regulatory mandates toward the development of cross border electric infrastructure to sustain the rising demand for the refurbishment of ageing transmission network will foster the circuit breaker market.

Cadence Design Systems announced that Toshiba Memory Corporation has successfully used the Cadence CMP Process Optimiser, a model calibration and prediction tool that accurately simulates multi-layer thickness and topography variability for the entire layer stack, to accelerate the delivery of its advanced 3D flash memory devices. With the Cadence solution in place, Toshiba Memory Corporation achieved 95.7% accuracy to silicon.

With mobile product shipments, dominated by smartphones, continuing to account for a significant amount of the non-volatile memory (NVM) market, suppliers and standardisation organisations are working hard to ensure that next-generation NVMs keep up with the demands placed upon them. Author: Axel Stoermann, Toshiba Memory Europe

TM Robotics is bringing its robot sketching demonstration to Automate 2019, held at McCormick Place, Chicago, from 8th-11th April 2019. TM Robotics will exhibit a range of Toshiba Machine’s robots, including the THL500 SCARA, which will be creating free artist impressions of visitors at booth number 6763.

At embedded world 2019, Toshiba Memory Europe will be exhibiting, where they will highlight the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. Toshiba will also demonstrate two new solid state drives (SSDs). All of these innovations are based on their 96-layer, BiCS FLASH 3D flash memory.

Toshiba has started sampling the 128GBversion of the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilises the company’s 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB. With high speed read/write performance and low power consumption, the new devices are suitable for applications such as mobile devices, smartphones, tablets, and augmented/virtual real...