Search results for "CU Phosco"
AMD expands automotive-grade FPGA family
AMD has introduced the latest addition to the AMD Automotive XA family, the Artix UltraScale+ XA AU7P.
Insight SiP launches the ISP2454-MX module
Insight SiP has introduced the ISP2454-MX, thesmallest moduleof its kind, measuring just 8 x 8 x 1mm.
Performance boost to STMicroelectronics’ STM32C0 series
STM32 developers can now get more memory and extra features in STM32C0 microcontrollers (MCUs) to support more sophisticated functionality in resource-constrained and cost-sensitive embedded applications.
VIAVI introduces new connector inspection solution
Viavi Solutions has introduced a new optical connector inspection solution aimed at next-generation transceivers.
u-blox launches first satellite IoT-NTN cellular module with embedded GNSS
u-blox, a global provider of leading positioning and wireless communication technologies and services, has launched its first combined 3GPP-compliant terrestrial network (TN) and non-terrestrial network (NTN) IoT module, the SARA-S528NM10.
Unipart's involvement in Project PULSE
Unipart Manufacturing is set to play a pivotal role in Project PULSE (Power Electronics Upscale for Localisation and Sustainable Electrification), a £11 million initiative funded by the UK government through the Advanced Propulsion Centre (APC).
SAOT: bringing AI to VAR for offside rulings
In recent years, football has increasingly embraced technology in a bid to enhance the sport's accuracy and fairness during matches. One of the most significant developments in this regard is Semi-automated Offside Technology (SAOT).
dSPACE to show off test solution at EuMW
At the upcoming European Microwave Week (EuMW), held from 22-27 September in Paris, dSPACE will debut a cutting-edge test solution designed for high-precision separation and interference testing of automotive radar sensors.
Cadence Tensilica HiFi 5 DSPs used in NXP’s audio DSP family
Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) have been integrated intoNXP Semiconductors' latest automotive audio DSP family.
Royal Academy of Engineering welcomes new President
Dr John Lazar CBE FREng, a global technology pioneer and investor, has been officially announced as the new President ofthe Royal Academy of Engineering.