Search results for "4G"
Tensilica - High-Performance ConnX Baseband Engine for LTE and 4G Wireless DSP Handsets and Base Stations
Tensilica has announced the first member of its new ConnX family of DSP cores for system-on-chip design. The ConnX Baseband Engine enables efficient baseband processing for 3G, LTE (Long-Term Evolution) and 4G wireless equipment with its scalable, high-performance DSP architecture that provides industry leading computational throughput of 16 18-bit MACs per cycle. The ConnX Baseband Engine features an optimized instruction set, high memory bandwi...
Tensilica and mimoOn Partner for LTE Baseband Handset Solutions
mimoOn, a pioneer in LTE software implementations for programmable radio platforms, and Tensilica® Inc., a leader in programmable and efficient IP cores for advanced mobile wireless SOCs (system-on-chips), today announced a partnership to offer best-in-class LTE solutions for mobile wireless radios based on mimoOn's mi!MobilePHY software and Tensilica's newly announced ConnX Baseband Engine (BBE16) and ConnX Atlas LTE Reference Design.
Tensilica Showcases 4G LTE Baseband DSP IP Cores at MWC 2011
Tensilica should stand out at this year's Mobile World Congress (MWC) in Barcelona, February 14-18, 2011, as it has moved into the number one position as the supplier of baseband DSP (digital signal processors) IP (intellectual property) cores for the new generation of 4G LTE (Long Term Evolution) equipment. Eight of the top 15 LTE chipset manufacturers are working with Tensilica's cores for their designs.
SySDSoft Ports Complete LTE Protocol Stack to Tensilica’s Atlas LTE Reference Architecture
Tensilica Inc. and SySDSoft announced today their partnership to port SySDSoft’s LTE UE protocol stacks onto Tensilica’s ConnX™ Atlas LTE (long-term evolution) reference architecture for User Equipment (UE). SySDSoft has joined Tensilica’s Xtensions™ partner network. SySDSoft has also ported its LTE protocol stack to the LTE system platform from mimoOn, who also is a Tensilica partner.
Intersil Introduces Industry's Best ADC Driver for High Speed Applications
Intersil Corporation (NASDAQ Global Select: ISIL) today introduced the ISL55210, an ultra-low distortion, low power, differential I/O amplifier providing unmatched Spurious Free Dynamic Range (SFDR) and Signal-to-Noise Ratio (SNR). This previously unavailable combination of high performance and low power now enables customers to implement very efficient high speed data acquisition systems and high bandwidth communications equipment.
TI’s multistandard wireless base station SoC drives performance and efficiency to record levels
Texas Instruments unveiled a new multistandard wireless base station System-on-Chip (SoC) delivering double the LTE performance and a 2x power/performance improvement over existing macro and compact base station SoC solutions developed in 40-nm process technology. Based on TI’s new TMS320C66x digital signal processor (DSP) generation, the TMS320TCI6618 utilizes a strategic design approach that accelerates the well-defined standard aspects o...
PoE enabled Industrial PC is launched by Nexcom
Nexcom has launched a powerful new Fan-less Industrial computer system which is targeted at PoE and/or Mobile DVR applications. Based on the Mobile Intel® GM45 Express chipset, NISE 3144 is a PoE enabled computer system which provides 4 x PoE interfaces for connection to a wide variety of Class 3 PoE enabled devices such as VoIP, IP Camera, wire-less access point and RFID reader.
TI delivers highest linearity, smallest dual, 16-bit, 800-MSPS interpolating DAC
Texas Instruments today introduced a 16-bit, 800-MSPS interpolating digital-to-analog converter (DAC), which provides 75 dBc third-order intermodulation distortion (IMD3) at 200 MHz. Offered in a 7-mm x 7-mm QFN package, the DAC3283 is also the smallest DAC in its class, saving valuable board space in wireless communications, software defined radio (SDR), test and measurement, and power amplifier linearization applications.
TI’s PowerStack packaging technology in volume production
Texas Instruments has shipped more than 30 million units of its PowerStack packaging technology, which significantly boosts performance, lowers power and improves chip densities in power management devices.
TI transmit/receive processors for 3G, 4G wireless base stations provide industry’s widest bandwidth digital pre-distortion
Texas Instruments introduced the industry’s widest bandwidth, fully-integrated transmit/receive processors with digital pre-distortion (DPD) for 3G and 4G wireless base stations, remote radio heads and government communication systems. The GC533x family features a duo of turn-key processors that provide a complete and highly flexible digital transmit and receive solution for wide-bandwidth and multi-antenna wireless base stations at a fract...