Search results for "drone"
Lynx to support communication protocols for deterministic systems based on NXP processors
Lynx Software has announced that it’s LYNX MOSA.ic software supports the Layerscape Processor LS1028A product family from NXP Semiconductors.
5x extended drone range makes humanitarian missions possible
The world’s first commercialised hydrogen fuel cells for drones delivers breakthrough performance with power modules. Electronic Specifier's Caroline Hayes discusses how Doosan Mobility Innovation (DMI) is delivering humanitarian relief to remote locations using drones powered by these innovative energy-dense hydrogen fuel cells.
Solar powered drones market to accumulate $3,803.4 million by 2033
According to Fact.MR, the global solar powered drones market will likely reach a valuation of $1,017 million in 2023 and is expected to grow at a CAGR of 14.1% during the forecast years of 2023-2033.
ePower stage ICs boost power density and simplify design
EPC announces the introduction of two new 100V power stage ICs rated at 15 A (EPC23104) and 25 A (EPC23103). The two devices join the 100V 35A power stage IC EPC23102 offered by EPC.
Wide-temp SMARC module with Qualcomm QCS610 SoC
IBASE Technology has launched the RM-QCS610 SMARC 2.1 compliant module powered by an Octa-core Qualcomm QCS610 SoC and designed for the creation of devices with edge artificial intelligence (AI) and machine learning capabilities such as vision-enhanced drones, advanced intelligent conferencing cameras, and smart robots.
£12m boost for delivery drones and personalised medicines
£12 million awarded to UK regulators to help drive forward innovation and support businesses bring their products and services to markets quickly.
Satellite Communication Market to grow $192bn by 2033
During the forecast period 2022-2032, the satellite communication market is expected to grow at a value of 9.4% CAGR. In 2021, this market was predicted to have a global valuation of $59.32bn, and is expected to reach a sum of $192.09bn by 2032.
Accelerometer and gyroscope in one
Würth Elektronik is expanding its range of compact MEMS-based sensors with a 3-axis accelerometer and integrated gyroscope.
Bostik extends Born2Bond engineering adhesives
Bostik has extended its Born2Bond engineering adhesive HMPUR and UV-CIPG ranges to support the manufacture of smaller, more lightweight, and increasingly complex consumer electronic devices that are also required to be recyclable and meet all relevant sustainability and safety regulations.
Silicon Labs announces new Bluetooth SoC and MCU
Silicon Labs has announced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).