Search results for "soldering"
Alps Unveils New Slide Switch for Mobile Devices
ALPS ELECTRIC EUROPE GmbH announced the development of the SSAJ series, a 0.7mm-high slide switch that enables the design of more compact electronic devices including mobile phones, digital cameras and compact music players. Sample shipments will commence from February 2010.
University of Queensland Delegation Visits Nihon Superior Co. Ltd.
Nihon Superior was honored to receive a visit by a delegation from the University of Queensland on October 7, 2011. Senior Deputy Vice-Chancellor Professor Michael Keniger was accompanied by Deputy Vice-Chancellor (International) Anna Ciccarelli, Ph.D., Deputy Director Global Engagement, Michelle Allan, Associate Professor and Principal Research Fellow, Mechanical and Mining Engineering Department, Dr. Kazuhiro Nogita and Business Development Off...
Nihon Superior Shanghai to Exhibit at NEPCON China 2012
Nihon Superior Shanghai Co. Ltd. will showcase a new and expanded range of products based on its SN100C silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai. Included in this expanded product range will be the first of Nihon Superior’s new SN100C Advantage SeriesTM alloys, SN99CN in the form of spheres and the solder paste SN99CN P502 D4.
Nihon Superior Introduces SN100C lead-free solder
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, introduces SN100C (551CT), the newest addition to its SN100C lead-free solder series.
Soldercup Header & Socket Interconnects for Medium Duty Applications
Mill-Max is expanding its line of wire termination interconnects with new socket and header strips rated at 4.5 amps per contact. These connectors feature pins and receptacles with soldercups that can accept up to 20 AWG stranded & 18 AWG solid wires. They are a convenient and reliable method to make connections between discrete wires or cables and mating components such as PC boards or other cable assemblies.
Mill-Max Introduces Horizontal SMT Spring-loaded Connectors
Mill-Max introduced the new 810 series Horizontal SMT Spring-loaded Connectors. 810 series connectors are ideal for low profile spring interconnections parallel to the board surface. Applications are recharging modules, grounding points, test points and board edge-to-edge interfaces, typically to our mating target connectors.
Mill-Max Vertical Display Sockets
Series 296, 299 and 594 vertical display sockets are used to mount dot matrix and 7-segment LED displays at the edge of and perpendicular to a printed circuit board. This positions the display directly behind the translucent front panel of the equipment.
Everlight Introduces the New Yi LED Lighting Series
Everlight Electronics again expands the Lighting Series component portfolio and introduces the Yi Series - a high power, high brightness and economic (superb $/lm) LED family with 5W power consumption in a compact ceramic package.
MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Upper Midwest
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball unit at SMTA Wisconsin/Great Lakes Expo & Tech Forum
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Wisconsin/Great Lakes Expo and Tech Forum, scheduled to take place August 24, 2010 at the Wyndham Airport Hotel in Milwaukee, WI.