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PCIM Europe 2024 program offers new highlights
The PCIM Europe will once again turn Nuremberg from 11-13 June 2024 into a hub for experts from all over the world, working together to drive forward power electronics. The exhibition and conference promise a variety of pioneering products, solutions, and presentations.
Würth Elektronik at PCIM Europe 2024
Würth Elektronik is exhibiting at PCIM Europe in Nuremberg, June 11-13, 2024. The manufacturer will present electronic and electromechanical components in Hall 6, Booth 342.
Overcome the five challenges threatening NTN success
Nancy Friedrich of Keysight Technologies talks about expanding aerospace and defence connectivity by addressing challenges threatening NTN success.
Vishay unveils 600 V E Series Power MOSFET
Vishay Intertechnology has launched its inaugural fourth-gen 600 V E Series power MOSFET in the innovative PowerPAK 8 x 8LR package, aimed at telecom, industrial, and computing applications.
BT Group powers up first EV charger using cabinet
BT Group has begun the installation of its inaugural electric vehicle (EV) charging point powered by a street cabinet, signalling the initial phase of trials that could prompt a broader overhaul of cabinet units throughout the UK.
Cliff Electronics expand its VHDCI cable range
Cliff Electronics has expanded its range of industry-standard VHDCI (very-high-density-cable-interconnect) “Centronics” style cables to meet the interconnection requirements of industries such as Defence, Aerospace, and Space.
What would Santa’s sleigh look like in the future?
As we look towards the future, Santa Claus’ legendary sleigh, an iconic symbol of Christmas joy and magic, is due for a high-tech makeover.
2024 predictions: NAND Flash, SSDs, AI, Security, LLMs, and more
Phison Electronics Corp. has announced its predictions for 2024 trends in NAND flash infrastructure deployment.
Avalue unveils latest Emerald Rapids server boards
Avalue has announced the latest server board solutions, the HPM-ERSUA (single socket) and HPM-ERSDE (dual sockets) server boards featuring the Intel 5th Generation Xeon Scalable Processors.
ROHM’s SiCrystal and STM expand wafer agreement
ROHM and STMicroelectronics have announced the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.