Search results for "Pickering interfaces"
Advanced video processor powers AI at the Edge
Teledyne FLIR, part of Teledyne Technologies, has announced Teledyne FLIR AVP, an advanced video processor designed to power Teledyne FLIR’s Prism AI and computational imaging at the Edge.
Advanced video processor powers AI at the Edge
Teledyne FLIR, part of Teledyne Technologies, has announced Teledyne FLIR AVP, an advanced video processor designed to power Teledyne FLIR’s Prism AI and computational imaging at the Edge.
Texas Instruments brings you the latest in Connectivity
Here, you’ll find a selection of the latest news, products, and articles from Texas Instruments focused on Connectivity.
DigiKey at embedded world 2024 with BeagleBoard's BeagleY-AI
At embedded world 2024, on the DigiKey booth, Paige West speaks with Jason Kridner, Co-Founder & President of the Board at BeagleBoard.org Foundation, and Rob Nelson, Application Engineer at DigiKey, about open-source benefits and the launch of the BeagleY-AI.
IDTechEx discusses the role of printed sensors in mass-digitisation
Integrated sensors digitising physical interactions are vital in everyday life. From personalised user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors – and lots of them.
Powercast's rugged RAIN RFID Reader for harsh environments
Powercast Corporation, the industry’s one-stop-shop for wireless power, has launched its Extended-Temperature RAIN RFID Reader Module designed to integrate into high-temperature RFID readers that need to reliably operate in the extreme conditions present in automotive, industrial, outdoor, energy, and other applications.
SoM with NXP i.MX93 in OSM-L form factor
Ronetix, a developer and manufacturer of high-performance System on Modules (SoM) solutions, announces its upcoming OSM-L 45 x 45mm SoM based on NXP i.MX93 64-bit dual-core 1.7GHz ARM Cortex-A55, alongside 250MHz Cortex-M33 for low latency and real-time tasks, up to 2GB LPDDR4-RAM and 512GB eMMC.
SoM with NXP i.MX93 in SMARC 82 x 50mm form factor
Ronetix, a developer and manufacturer of high-performance System on Modules (SoM) solutions, announces its upcoming SMARC 82 x 50mm SoM based on NXP i.MX93 64-bit dual-core 1.7GHz ARM Cortex-A55, alongside 250MHz Cortex-M33 for low latency and real-time tasks, up to 2GB LPDDR4-RAM and 512 GB eMMC.
The new 3.5-inch congatec HPC/3.5-Mini carrier board
congatec has presented the first board-level product in its line with its recently introduced aReady. strategy.
Eight cores unlock advanced virtualisation potential
congatec – a provider of embedded and Edge computing technology – presents new rugged SMARC modules based on the Intel Atom x7000RE processor series (codenamed Amston Lake) and the Intel Core i3 processor.