Search results for "Blu Wireless"
Navigating the next frontier of Wi-Fi 7 performance: rigorous RF, signalling, and throughput testing
In wireless communications, the advancement of Wi-Fi 7 opens a new era of ultra-fast networks and reliable connectivity.
e-peas energy harvesting tech powers stand-alone sensor applications
e-peas, the supplier of energy harvesting PMICs, announces that its efficient power management technology is providing the foundation for numerous demonstrations of energy harvesting in stand-alone sensor applications on show at Sensors Converge (25–26 June 2024, Santa Clara, US).
LED driver promises greener future
MEAN WELL’s LED power supply solutions are designed to propel the lighting industry towards a greener, more sustainable future.
Arrow's reference design for EV charger development
Arrow Electronics has introduced a data-communication reference design tailored for electric vehicle (EV) charging systems, incorporating advanced software protocols and a HomePlug Green PHY hardware module.
Samtec expands Magnum RF Line with low-profile option
Samtec’s ganged, multi-port SMPM Magnum RF product family is now available with a low-profile 3.94mm (.155") body height, right-angle option for maximum channel density in low- or mid-band systems. Samtec’s GPPC Series offers the industry’s first low-profile, right-angle multi-port solution with performance out to 50 GHz.
Kiwi drivers ready to adopt wireless EV technology
New Zealanders are showing optimism towards the potential of dynamic wireless charging for electric vehicles (EVs), despite some concerns.
Ceva enhances Edge AI with TinyML NPUs for AIoT devices
Ceva, the pioneering licensor of silicon and software IP that enables Smart Edge devices to connect, sense, and infer data more reliably and efficiently, announces that it has extended its Ceva-NeuPro family ofEdge AINPUs with the introduction ofCeva-NeuPro-NanoNPUs.
Rohde & Schwarz signs up to AI-RAN Alliance
Rohde & Schwarz has become the latest member of the recently formed AI-RAN Alliance.
Sonical and XMOS collaborate for Headphone 3.0 at CES 2024
At CES, Las Vegas, 2024, Sonical, the company pioneering the principles of Headphone 3.0, and XMOS, a deep tech semiconductor company at the leading edge of the intelligent IoT, are proudly announcing a joint development.
Embedded system are changing intelligent transportation
Cutting-edge technologies like AI, deep learning, Edge computing, and cloud-based video surveillance are revolutionising intelligent transportation monitoring and surveillance.