Search results for "Sfera labs"

Akros Silicon announces its AS1854 Power-over-Ethernet (PoE) Powered-Device System-on-Chip (PD SoC) has successfully demonstrated compliance with IEEE 802.3at and IEE802.3af standards and multi-vendor interoperability. Results were announced following tests conducted by the University of New Hampshire InterOperability Laboratory.

Verizon Wireless announced today that the company has selected Spirent Communications as a provider of testing solutions for the certification of devices that will operate on the nationwide 4G Long Term Evolution (LTE) network that Verizon Wireless is building on the Upper 700 MHz C-Block spectrum.

Addressing the growing trend of large touchscreen consumer electronics products, Synaptics Inc. (NASDAQ: SYNA), a leading developer of human interface solutions for mobile computing, communications, and entertainment devices, is announcing its ClearPad™ 7200 Series technology offering. Utilizing the feature-rich capability offered by Synaptics-designed full image sensor technology, the ClearPad 7200 Series is ideal for OEMs designing a wide ran...

Aeroflex launched the AX-Series at SEMICON West today, a completely new product line for characterization and production testing of consumer RF and mixed-signal semiconductors.

Cypress Semiconductor Corp. (Nasdaq: CY) and BG Partners today announced that teams from Moscow State University (Physics Department, Precision Sensors Labs) and from Moscow Institute of Electronics and Mathematics (Electronics and EE Department) are the winners of the fourth annual Professor E.I. Tochitsky Fellowship Award.

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced the certification of its VL700 USB 3.0-SATA Controller by the USB Implementers Forum (USB-IF). The comprehensive suite of tests conducted as part of the USB-IF Compliance and Certification Program ensures that certified products are interoperable with existing USB devices, while also offering all the speed and power enhancements of the new USB 3.0 (SuperSpe...

Direct Insight, an official Windows Embedded Training Partner and Windows Embedded Gold Partner, and Avnet Embedded, Europe’s leading distributor of Microsoft’s Embedded Operating Systems are partnering to provide two intensive training courses to help students prepare for Microsoft Technical Specialist Certifications in using Microsoft Embedded Operating Systems to create embedded devices.

Plessey Semiconductors announced today that it has agreed to a product licensing agreement with Intel Corporation and a share warrant agreement with Intel Capital. Under the terms of the licensing agreement, Plessey will be licensed to manufacture, sell and support a select number of products in Intel's digital tuner portfolio. The warrant agreement is for an unspecified number of shares in Plessey's holding company.

A123Systems announced today it has raised $69 million from GE and other investors to accelerate the expansion of its US lithium ion battery manufacturing and smart grid capabilities. The capital will help create new jobs by expanding A123’s facilities in Hopkinton, MA, and Novi, MI, as well as build planned new factories in Michigan. The funding will also support A123’s efforts to develop applications for the smart grid, such as utility-scale...

Autodesk, Inc. (NASDAQ: ADSK) introduced its new 3D design and engineering software portfolio for manufacturers, including the new Autodesk Product Design Suite that makes design, visualization and simulation software easier to adopt, use and maintain. The complete Autodesk Digital Prototyping software portfolio helps manufacturers to design and build better, more sustainable products, reduce development costs and get to market faster.