Search results for "4G"
Keithley to Develop RF WiMAX Production Test Solution for Fujitsu
Keithley Instruments has announced that it is developing a WiMAX device production test solution for two 802.16e WiMAX devices from Fujitsu Microelectronics Limited. This WiMAX RF SISO/MIMO manufacturing test configuration features Keithley’s award-winning RF test solutions, the Model 2820 RF Vector Signal Analyzer and Model 2920 RF Vector Signal Generator. The configuration will enable Fujitsu Microelectronics to perform a set of Tx and Rx tes...
EL620-C ATX Motherboard Supports ISA Bus Applications
DFI, a leading provider of embedded x86 products, today launches the EL620-C ATX form factor motherboard utilizing a low-cost Intel® G41 Express chipset with Intel® I/O Controller Hub 7. This new embedded board supports the 45nm Intel® Core™2 Quad processor Q9400 with up to 6MB of shared L2 cache and up to 1333MHz Front Side Bus (FSB), delivering high-performance computing in multi-threaded and multitasking environments. Embedded Intel® Arc...
EC200 Series System Features Modular Construction Targeting Industrial Computing Applications
DFI today launches the industrial grade EC200 series systemwith passive cooling and anti-shock drive bay mounting designedfor factory floor environments. The unique modular-concept construction supports 12 system confi gurations using three riser cards and three I/O module options in a cable-free assembly. Virtually unlimited systems confi gurations are possible using low-cost OEM I/O modules designed to meet custom OEM specifi cation requirement...
Verizon Wireless Selects Tektronix Communications To Monitor Nationwide Next-Generation LTE Network
Verizon Wireless announced today it has selected Tektronix Communications’ Iris suite of solutions to support the monitoring of Verizon Wireless’ next-generation LTE services. The Iris suite of products provides multiple organizations at a service provider with real-time and historical information for service troubleshooting and performance monitoring needs. Tektronix Communications was chosen following a rigorous selection process for solu...
Tektronix Communications Iris Suite Receives Prestigious Industry Awards
Tektronix Communications announced today that the company’s Iris suite with LTE Evolved Packet Core (EPC) and the Iris Performance Intelligence (IPI) monitoring solutions received the 2010 INTERNET TELEPHONY Product of the Year Award from TMC, a global, integrated media company, and the 2010 4GWE Product of the Year Award from TMC and Crossfire Media.
Advantech Boosts Packetarium and ATCA Blade Throughput with Highest Performance Cavium Networks 32-Core OCTEON II® CN6880 Processor
Advantech (TWSE: 2395.TW), a global manufacturer of telecom computing blades and multi-core processor platforms, today announced the new ATCA-7310 and NCPB-2320 Packet Processing Engines (PPE) at Interop 2011.
Axis Network Technology Changes Company Name to AceAxis and Develops In-House Manufacturing
Following its acquisition by Ace Technology Corporation in May 2010, Axis Network Technology, a leading supplier of Remote Radio Head technology for 4G telecom networks, announced today that it has changed its name to AceAxis Ltd. The company is simultaneously announcing its plans to develop manufacturing plants in Korea and elsewhere in Asia.
GE to Bring High-Efficiency Energy Solutions to Telecommunications and Datacenter Industries with Acquisition of Lineage Power from The Gores Group
GE today announced it has signed an agreement to acquire privately-held Lineage Power Holdings, Inc., from The Gores Group, LLC. Lineage Power is a leading global provider of high-efficiency power conversion infrastructure technology and services for the telecommunications and datacenter industries. The deal will open the door for GE Energy technology to be deployed in the $20 billion per year power conversion space, where the demand for reliable...
WIN Enterprises announces a 3.5 SBC with Intel ULV N2600/D2700/N2800 and DDR3
WIN Enterprises announces the MB-80410, 3.5” Single Board
Super Talent Technology announces a new line of Green-line series lower-power consumption DDR3 memory modules for servers.
These new eco-friendly modules feature lower operating voltages, lightweight and smaller form factors which improve cooling while continuing to satisfy the latest JEDEC standards. Super Talent engineers worked to reduced product height and succeeded with modules that measure 0.72 inches high; a full 39% reduction from a standard size module, yet can deliver speeds at 1600MHz and at 4GB capacities.