Search results for "soldering"

KOA has expanded its RN73H series of high precision thin film flat chip resistors with size 0402 and higher ohmic values in all other sizes. The RN73H series provides excellent long term stability, typically below 0.05% resistance change over 1000 hours. The typical resistance change due to soldering heat is below 0.01%.

Vishay announced the release of new power surface-mount white LEDs in two binning versions. For a wider range of pin compatibility with similar devices, the VLMW321xx LEDs feature three anodes and one cathode, while the VLMW322xx LEDs offer three cathodes and one anode.

Vishay Intertechnology has broadened its optoelectronics portfolio with the introduction of an 870-nm SMD infrared emitter with the industry’s lowest forward voltage and highest radiant intensity of any such device in the PLCC2 package.

Vishay Intertechnology, Inc. today announced the release of new TFU 0603 thick film flat chip fuses that offer very quick-acting fuse characteristics in a smaller chip size. The devices feature rated current values up to 4.0 A and a breaking capacity of 35 A up to a rated voltage of 32 V.

Hamamatsu Photonics introduce a new RGB colour sensor Photo IC, the S11059-78HT. The new device features I2C compatibility and uses a small and highly reliable WL-CSP (Wafer Level – Chip Size Package).

In addition to traditional single-, dual-, triple-row and grid array patterns, Advanced Interconnections Corp. now offers its extensive line of Peel-A-Way removable terminal carriers in nonlinear configurations.

The MCM series of terminal blocks from SAURO allow a high current rating (16A / 750V) by means of a contact spring wiring system. This product maintains a tightening force which is comparable to the rising clamp. Moreover, by using a contact spring system wiring can be carried out quickly and it is not affected by vibrations. It is possible to use rigid or flexible wires with ferrules, but flexible wires without ferrules can also be used by press...

The MOST Cooperation has overhauled the Physical Layer Specification: Based on lessons-learned of today's MOST25 networking generation, a working group consisting of car, device and component makers has developed a new Physical Layer Specification for MOST150. The specification is available to members of the MOST Cooperation as part of the MOST Rev. 3.0 specification set and can be used for implementation into products.

Wolfson Microelectronics has announced the launch of the first devices in its family of silicon microphones due for release over the next 12 months. The WM7110 and WM7120 are compact, high Signal to Noise ratio (SNR) analogue microphones for use in consumer applications requiring low power consumption and excellent signal quality. Using Wolfson’s proprietary CMOS/MEMS membrane technology the new devices deliver high reliability and performance ...

Patch panels and breakout boxes often require a large number of test sockets to be located in a small area, making cut outs, fixing and soldering awkward. This problem can be alleviated by the use of Multi-Contact's 20 pole socket strips rather than individual sockets.